Noise exposure assessment and prevention around high-speed rail von Tsai, K.-T., Lin, M.-D., Lin, Y.-H.

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ITO as a Diffusion Barrier Between Si and Cu von Liu, C M, Liu, W L, Chen, W J, Hsieh, S H, Tsai, T K, Yang, L C

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Temperature and pH dependence of the electroless Ni–P deposition on silicon von Liu, W.L., Hsieh, S.H., Tsai, T.K., Chen, W.J., Wu, Shin Shyan

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Effect of phosphorus on the copper diffusion barrier properties of electroless CoWP films von Tsai, T.K., Wu, S.S., Hsu, C.S., Fang, J.S.

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The Transparent Conductive Properties of Manganese-Doped Zinc Oxide Films Deposited by Chemical Bath Deposition von Fang, J.S., Luo, W.H., Hsu, C.H., Yang, J.C., Tsai, T.K.

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Neoadjuvant docetaxel followed by adjuvant doxorubicin and cyclophosphamide in patients with stage III breast cancer von Gradishar, W.J., Wedam, S.B., Jahanzeb, M., Erban, J., Limentani, S.A., Tsai, K.-T., Olsen, S.R., Swain, S.M.

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Spectral properties and thermal stability of CrN/CrON/Al2O3 spectrally selective coating von Tsai, T.K., Li, Y.H., Fang, J.S.

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Effect of nickel on the initial growth behavior of electroless Ni–Co–P alloy on silicon substrate von Liu, W.L., Chen, W.J., Tsai, T.K., Hsieh, S.H., Chang, S.Y.

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Interfacial reactions of electroless nickel thin films on silicon von Liu, C.M., Liu, W.L., Hsieh, S.H., Tsai, T.K., Chen, W.J.

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Efficacy and safety of biologics and small molecule inhibitors in treating genital psoriasis: A systematic review of randomised controlled trials von Lai, Chien-Cheng, Shao, Shih-Chieh, Tsai, Ethan Tk, Chi, Ching-Chi

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Electrical and optoelectronic characterization of a ZnO nanowire contacted by focused-ion-beam-deposited Pt von He, J H, Chang, P H, Chen, C Y, Tsai, K T

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Effect of tin-doped indium oxide film as capping layer on the agglomeration of copper film and the appearance of copper silicide von Liu, W.L., Chen, W.J., Tsai, T.K., Hsieh, S.H., Liu, C.M.

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Effect of tin-doped indium oxide film thickness on the diffusion barrier between silicon and copper von Liu, W.L., Chen, W.J., Tsai, T.K., Hsieh, S.H., Liu, C.M.

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Electroless CoWP as a diffusion barrier between electroless copper and silicon von TSAI, T. K, WU, S. S, LIU, W. L, HSIEH, S. H, CHEN, W. J

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Fracture resistance of compomer and composite restoratives von Yap, Adrian U J, Chung, S M, Chow, W S, Tsai, K T, Lim, C T

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Deposition of electroless Ni on micro-sized acrylic spheres von LIU, W. L, HSIEH, S. H, TSAI, T. K, CHEN, W. J

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Stress-based and path-based fault injection von Tsai, T.K., Mei-Chen Hsueh, Hong Zhao, Kalbarczyk, Z., Iyer, R.K.

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Elastic modulus of resin-based dental restorative materials: A microindentation approach von Chung, S.M., Yap, A.U.J., Tsai, K.T., Yap, F.L.

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High strain rate testing of solder interconnections von Tsai, K.T, Liu, F-L, Wong, E.H, Rajoo, R

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Bone response to unloaded titanium implants in the fibula, iliac crest, and scapula: an animal study in the Yorkshire pig von Rohner, D., Meng, C.S., Hutmacher, D.W., Tsai, K.T.

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