Combined XRR and RS Measurements of Nickel Silicide Films von Gonchond, J.-P., Cacho, F., Wyon, C., Rolland, G., Braeckelmann, G., Kwakman, L.F.Tz, Tsach, Y., Agnihotri, D.K., Formica, J.P.

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Modelling the phenomenon of elements separation in GSR particles containing aluminum using information theory analysis and molecular dynamics simulation von Cohen, N., Gohberg, D., Israelsohn Azulay, O., Tsach, T., Hassin, Y., Raz, T.

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An Aramaic-Inscribed Cultic Object from Tulûl Mas‘ud, Elyakhin von Lewis, Rafael Y., Finkelstein, Nir, Lewis, Rona S. Avissar, Eshel, Esther, Baruch, Yuval, Maor, Yonah, Tsach, Tsadok, Tal, Oren

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Comparison of thin films of YBa2Cu3O7− x deposited by physical (laser ablation) and chemical (OMCVD) methods for device applications von Schieber, M., Han, S.C., Ariel, Y., Chokron, S., Tsach, T., Maharizi, M., Deutscher, C., Racah, D., Raizman, A., Rotter, S.

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Comparison of thin films ofYBa2Cu3O7−x deposited by physical (laser ablation) and chemical (OMCVD) methods for device applications von Schieber, M., Han, S.C., Ariel, Y., Chokron, S., Tsach, T., Maharizi, M., Deutscher, C., Racah, D., Raizman, A., Rotter, S.

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Comparison of thin films of YBa2Cu30O7-x deposited by physical (laser ablation) and chemical (OMCVD) methods for device applications von SCHIEBER, M, HAN, S. C, ARIEL, Y, CHOKRON, S, TSACH, T, MAHARIZI, M, DEUTXHER, C, RACAH, D, RAIZMAN, A, ROTTER, S

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