Augmenting the Floating Car Data Approach by Dynamic Indirect Traffic Detection von Ruppe, Sten, Junghans, Marek, Haberjahn, Mathias, Troppenz, Christian

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Hybrid integration of silicon photonics circuits and InP lasers by photonic wire bonding von Billah, Muhammad Rodlin, Blaicher, Matthias, Hoose, Tobias, Dietrich, Philipp-Immanuel, Marin-Palomo, Pablo, Lindenmann, Nicole, Nesic, Aleksandar, Hofmann, Andreas, Troppenz, Ute, Moehrle, Martin, Randel, Sebastian, Freude, Wolfgang, Koos, Christian

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Hybrid external-cavity lasers (ECL) using photonic wire bonds as coupling elements von Xu, Yilin, Maier, Pascal, Blaicher, Matthias, Dietrich, Philipp-Immanuel, Marin-Palomo, Pablo, Hartmann, Wladislaw, Bao, Yiyang, Peng, Huanfa, Billah, Muhammad Rodlin, Singer, Stefan, Troppenz, Ute, Moehrle, Martin, Randel, Sebastian, Freude, Wolfgang, Koos, Christian

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Hybrid multi-chip assembly of optical communication engines by in situ 3D nano-lithography von Blaicher, Matthias, Billah, Muhammad Rodlin, Kemal, Juned, Hoose, Tobias, Marin-Palomo, Pablo, Hofmann, Andreas, Kutuvantavida, Yasar, Kieninger, Clemens, Dietrich, Philipp-Immanuel, Lauermann, Matthias, Wolf, Stefan, Troppenz, Ute, Moehrle, Martin, Merget, Florian, Skacel, Sebastian, Witzens, Jeremy, Randel, Sebastian, Freude, Wolfgang, Koos, Christian

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3D-printed optical probes for wafer-level testing of photonic integrated circuits von Trappen, Mareike, Blaicher, Matthias, Dietrich, Philipp-Immanuel, Dankwart, Colin, Xu, Yilin, Hoose, Tobias, Billah, Muhammad Rodlin, Abbasi, Amin, Baets, Roel, Troppenz, Ute, Theurer, Michael, Wörhoff, Kerstin, Seyfried, Moritz, Freude, Wolfgang, Koos, Christian

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3D-printed optical probes for wafer-level testing of photonic integrated circuits von Trappen, Mareike, Blaicher, Matthias, Dietrich, Philipp-Immanuel, Dankwart, Colin, Xu, Yilin, Hoose, Tobias, Billah, Muhammad Rodlin, Abbasi, Amin, Baets, Roel, Troppenz, Ute, Theurer, Michael, Woerhoff, Kerstin, Seyfried, Moritz, Freude, Wolfgang, Koos, Christian

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Hybrid multi-chip assembly of optical communication engines by in situ 3D nano-lithography von Blaicher, Matthias, Billah, Muhammad Rodlin, Kemal, Juned, Hoose, Tobias, Marin-Palomo, Pablo, Hofmann, Andreas, Kutuvantavida, Yasar, Kieninger, Clemens, Dietrich, Philipp-Immanuel, Lauermann, Matthias, Wolf, Stefan, Troppenz, Ute, Moehrle, Martin, Merget, Florian, Skacel, Sebastian, Witzens, Jeremy, Randel, Sebastian, Freude, Wolfgang, Koos, Christian

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Hybrid integration of silicon photonics circuits and InP lasers by photonic wire bonding von Billah, Muhammad Rodlin, Blaicher, Matthias, Hoose, Tobias, Philipp-Immanuel Dietrich, Marin-Palomo, Pablo, Lindenmann, Nicole, Nesic, Aleksandar, Hofmann, Andreas, Troppenz, Ute, Moehrle, Martin, Randel, Sebastian, Freude, Wolfgang, Koos, Christian

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Chirp removal from directly modulated laser signals by two-stage fiber cross-phase modulation von Kato, T., Elschner, R., Richter, T., Okabe, R., Meuer, C., Troppenz, U., Schubert, C., Watanabe, S.

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