RE (La, Nd and Yb) doped CeO2 abrasive particles for chemical mechanical polishing of dielectric materials: Experimental and computational analysis von Cheng, Jie, Huang, Shuo, Li, Yang, Wang, Tongqing, Xie, Lile, Lu, Xinchun

Volltext

Potassium persulfate as an oxidizer in chemical mechanical polishing slurries relevant for copper interconnects with cobalt barrier layers von Zhang, Lifei, Wang, Tongqing, Lu, Xinchun

Volltext

LINC00958 promotes bladder cancer carcinogenesis by targeting miR-490-3p and AURKA von Zhen, Hongtao, Du, Peng, Yi, Qiang, Tang, Xiaolong, Wang, Tongqing

Volltext

Effect of photocatalytic oxidation technology on GaN CMP von Wang, Jie, Wang, Tongqing, Pan, Guoshun, Lu, Xinchun

Volltext

Synthesis of CeO2 Nanoparticles Derived by Urea Condensation for Chemical Mechanical Polishing von Wang, Zhenyang, Wang, Tongqing, Zhang, Lifei, Lu, Xinchun

Volltext

Detecting seasonal and long-term vertical displacement in the North China Plain using GRACE and GPS von Wang, Linsong, Chen, Chao, Du, Jinsong, Wang, Tongqing

Volltext

Endpoint Detection Based on Optical Method in Chemical Mechanical Polishing von Tian, Fangxin, Wang, Tongqing, Lu, Xinchun

Volltext

Exploiting interaction of fine and coarse features and attribute co-occurrence for person attribute recognition von Sun, Zhiyong, Ye, Junyong, Wang, Tongqing, Jiang, Li, Li, Yang

Volltext

Chemical effects on the tribological behavior during copper chemical mechanical planarization von Li, Jing, Liu, Yuhong, Wang, Tongqing, Lu, Xinchun

Volltext

Synergetic effect of potassium molybdate and benzotriazole on the CMP of ruthenium and copper in KIO4-based slurry von Cheng, Jie, Wang, Tongqing, Mei, Hegeng, Zhou, Wenbin, Lu, Xinchun

Volltext

Fabrication of Flexible and Transparent Metal Mesh Electrodes Using Surface Energy‐Directed Assembly Process for Touch Screen Panels and Heaters von Yuan, Siqing, Fan, Zebin, Wang, Guangji, Chai, Zhimin, Wang, Tongqing, Zhao, Dewen, Busnaina, Ahmed A., Lu, Xinchun

Volltext

Improvement of via dishing and non-uniformity in TSV chemical mechanical planarization von Rao, Can, Wang, Tongqing, Wang, Jie, Liu, Yuhong, Lu, Xinchun

Volltext

Kinematic analysis of in situ measurement during chemical mechanical planarization process von Li, Hongkai, Wang, Tongqing, Zhao, Qian, Meng, Yonggang, Lu, Xinchun

Volltext

Electrochemical investigation of copper passivation kinetics and its application to low-pressure CMP modeling von Li, Jing, Liu, Yuhong, Wang, Tongqing, Lu, Xinchun, Luo, Jianbin

Volltext

Augmenting bag-of-words: a robust contextual representation of spatiotemporal interest points for action recognition von Li, Yang, Ye, Junyong, Wang, Tongqing, Huang, Shijian

Volltext

Kinematic Optimization for Chemical Mechanical Polishing Based On Statistical Analysis of Particle Trajectories von Zhao, Dewen, Wang, Tongqing, He, Yongyong, Lu, Xinchun

Volltext

Numerical and experimental investigation on multi-zone chemical mechanical planarization von Wang, Tongqing, Lu, Xinchun

Volltext

Correlation Analysis of Erectile Dysfunction with Lower Urinary Tract Symptoms (LUTS) Degree and Clinical Features in LUTS Patients von Wang, Lei, Wang, Tongqing, Liu, Jian, Wang, Jizheng

Volltext

An integrated deep multiscale feature fusion network for aeroengine remaining useful life prediction with multisensor data von Li, Xingqiu, Jiang, Hongkai, Liu, Yuan, Wang, Tongqing, Li, Zhenning

Volltext

Effect of a Cu seed layer on electroplated Cu film von Pan, Yan, Liu, Yuhong, Wang, Tongqing, Lu, Xinchun

Volltext