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  1. 1
    Environmental Stress Testing of Wafer-Level Au-Au Thermocompression Bonds Realized at Low Temperature: Strength and Hermeticity

    Environmental Stress Testing of Wafer-Level Au-Au Thermocompression Bonds Realized at Low Temperature: Strength and Hermeticity von Malik, N., Tofteberg, H. R., Poppe, E., Finstad, T. G., Schjølberg-Henriksen, K.


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  2. 2
    Hermeticity and Reliability of Au-Au Thermocompression Bonds, Realized at Low Temperature

    Hermeticity and Reliability of Au-Au Thermocompression Bonds, Realized at Low Temperature von Malik, Nisant, Tofteberg, Hannah, Poppe, Erik, Finstad, Terje G, Schjolberg-Henriksen, Kari


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  3. 3
    Environmental Stress Testing of Wafer-Level Au-Au Thermocompression Bonds Realized at Low Temperature: Strength and Hermeticity

    Environmental Stress Testing of Wafer-Level Au-Au Thermocompression Bonds Realized at Low Temperature: Strength and Hermeticity von Malik, N., Tofteberg, H. R., Poppe, E., Finstad, T. G., Schjølberg-Henriksen, K.


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