Detection of In-Plane Movement in Electrically Actuated Microelectromechanical Systems Using a Scanning Electron Microscope von Nieminen, Tarmo, Tiwary, Nikhilendu, Ross, Glenn, Paulasto-Kröckel, Mervi

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Impact of Inherent Design Limitations for Cu-Sn SLID Microbumps on Its Electromigration Reliability for 3D ICs von Tiwary, Nikhilendu, Ross, Glenn, Vuorinen, Vesa, Paulasto-Krockel, Mervi

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Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C von Golim, Obert, Vuorinen, Vesa, Ross, Glenn, Wernicke, Tobias, Pawlak, Marta, Tiwary, Nikhilendu, Paulasto-Kröckel, Mervi

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Fatigue Crack Networks in Die-Attach Layers of IGBT Modules Under a Power Cycling Test von Liu, Shenyi, Vuorinen, Vesa, Liu, Xing, Fredrikson, Olli, Brand, Sebastian, Tiwary, Nikhilendu, Lutz, Josef, Paulasto-Krockel, Mervi

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Finite Element Simulation of Solid-Liquid Interdiffusion Bonding Process: Understanding Process-Dependent Thermomechanical Stress von Tiwary, Nikhilendu, Vuorinen, Vesa, Ross, Glenn, Paulasto-Krockel, Mervi

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Low Cost, Large Area, Flexible Graphene Nanocomposite Films for Energy Harvesting Applications von Kandpal, Manoj, Palaparthy, Vijay, Tiwary, Nikhilendu, Rao, V. Ramgopal

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Fabrication, Characterization and Application of ZnO Nanostructure-Based Micro-Preconcentrator for TNT Sensing von Tiwary, Nikhilendu, Vinchurkar, Madhuri, Patel, Mihir, Nathawat, Rashi, Pandey, Swapnil, Rao, V. Ramgopal

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Critical analysis of micro-thermogravimetry of CuSO 4· 5H 2 O crystals using heatable microcantilevers von Tiwary, Nikhilendu, Zakerin, Marjan, Natalio, Filipe, Biegler, Eugen, Marco, Fritzsche, Kaubitzsch, Hermann, Laha, Apurba, Berger, Rüdiger, Rao, V Ramgopal

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Critical analysis of micro-thermogravimetry of CuSO4·5H2O crystals using heatable microcantilevers von Tiwary, Nikhilendu, Zakerin, Marjan, Natalio, Filipe, Biegler, Eugen, Marco, Fritzsche, Kaubitzsch, Hermann, Laha, Apurba, Berger, Rüdiger, Rao, V Ramgopal

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