Ligand Effects on the Overpotential for Dioxygen Reduction by Tris(2-pyridylmethyl)amine Derivatives von Thorseth, Matthew A, Letko, Christopher S, Tse, Edmund C. M, Rauchfuss, Thomas B, Gewirth, Andrew A

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Microscopy of Polyurea Grease von Thorseth, Matthew A., Harris, Joseph D., Gu, Junsi, Cuthbert, John, Huffman, Lauren, Capaldo, Kevin, Jia, Zhe

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Dioxygen and Hydrogen Peroxide Reduction with Hemocyanin Model Complexes von Thorseth, Matthew A, Letko, Christopher S, Rauchfuss, Thomas B, Gewirth, Andrew A

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Cu complexes that catalyze the oxygen reduction reaction von Thorseth, Matthew A., Tornow, Claire E., Tse, Edmund C.M., Gewirth, Andrew A.

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Laboratory Scale Photogrammetry: Micro- and Macroscopic 3D Surface Imaging von Monaenkova, Daria, Deese, Diana, Schuette, Chad, Thorseth, Matthew

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Self-standing permselective CMS membrane from melt extruded PVDC von Liu, Junqiang, Goss, Janet, Calverley, Ted, Meyers, Greg, Thorseth, Matthew A., Todd, Clifford S., Kang, Joo, Denise, Anaya, Clements, Heidi, Klann, John, Mabe, Karla, Xu, Liren, Brayden, Mark, Martinez, Marcos

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Electroplating bath analysis von Thorseth Matthew A

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ELECTROPLATING BATH ANALYSIS von Thorseth, Matthew A

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Electroplating bath analysis von THORSETH MATTHEW A

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ELECTROPLATING BATH ANALYSIS von THORSETH, MATTHEW A

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ELECTROPLATING BATH ANALYSIS von THORSETH MATTHEW A

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METHOD OF ELECTROPLATING COPPER INTO A VIA ON A SUBSTRATE FROM AN ACID COPPER ELECTROPLATING BATH von CIULLO, Corey, THORSETH, Matthew, SCALISI, Mark

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PLATING METHOD von GOMEZ, Luis A, SCALISI, Mark A, LIEB, Bryan, HAZEBROUCK, Rebecca Lea, LEFEBVRE, Mark, THORSETH, Matthew A

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METHOD OF ELECTROPLATING COPPER INTO A VIA ON A SUBSTRATE FROM AN ACID COPPER ELECTROPLATING BATH von CIULLO, Corey, THORSETH, Matthew, SCALISI, Mark

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METHOD OF ELECTROPLATING COPPER INTO A VIA ON A SUBSTRATE FROM AN ACID COPPER ELECTROPLATING BATH von Ciullo Corey, Scalisi Mark, Thorseth Matthew

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Copper electroplating baths and electroplating methods capable of electroplating megasized photoresist defined features von Niazimbetova, Zuhra, Scalisi, Mark, Hazebrouck, Rebecca, Thorseth, Matthew, Dziewiszek, Joanna

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COPPER ELECTROPLATING BATHS AND ELECTROPLATING METHODS CAPABLE OF ELECTROPLATING MEGASIZED PHOTORESIST DEFINED FEATURES von NIAZIMBETOVA, Zuhra, DZIEWISZEK, Joanna, THORSETH, Matthew, SCALISI, Mark, HAZEBROUCK, Rebecca

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Cu-Containing Oxygen Reduction Catalysts von Gewirth, Andrew, Tornow, Claire, Thorseth, Matthew

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Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyrazole compounds and bisepoxides von Niazimbetova, Zuhra, Pokhrel, Ravi, Scalisi, Mark, Thorseth, Matthew, Byrnes, James, Dziewiszek, Joanna

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COPPER ELECTROPLATING BATHS AND ELECTROPLATING METHODS CAPABLE OF ELECTROPLATING MEGASIZED PHOTORESIST DEFINED FEATURES von Scalisi Mark, Dziewiszek Joanna, Hazebrouck Rebecca, Thorseth Matthew, Niazimbetova Zuhra

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