Impact of packaging design on reliability of large die Cu/low-κ (BD) interconnect von Chai, T.C., Xiaowu Zhang, Li, H.Y., Sekhar, V.N., Hnin, W.Y., Thew, M.L., Navas, O.K., Lau, J., Murthy, R., Balakumar, S., Tan, Y.M., Cheng, C.K., Liew, S.L., Chi, D.Z., Zhu, W.H.

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Reliability Results of 0.8 mil Fine Pitch Copper wire bonding on Immersion Gold Plated Pad for Copper Low-k Devices von Leong Ching Wai, Xiaowu Zhang, Kripesh, V., Premachandran, C.S., Chong, S.C., Ying Ying Liu, Madhukumar, J., Srinivas, V.R., Thaw, P.P., Jong, M.J., Lau, J.H., Wang, S., Foo, C.K., Thew, M.L., Myo, E.P.P., Teo, W.L.

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