Power electronic assemblies: Thermo-mechanical degradations of gold-tin solder for attaching devices von Arabi, F., Theolier, L., Martineau, D., Deletage, J.-Y., Medina, M., Woirgard, E.

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Identification and analysis of power substrates degradations subjected to severe aging tests von Woirgard, E., Arabi, F., Sabbah, W., Martineau, D., Theolier, L., Azzopardi, S.

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A New Junction Termination Using a Deep Trench Filled With BenzoCycloButene von Theolier, L., Mahfoz-Kotb, H., Isoird, K., Morancho, F., Assie-Souleille, S., Mauran, N.

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Electrical characterization under mechanical stress at various temperatures of PiN power diodes in a health monitoring approach von Baccar, F., Azzopardi, S., Theolier, L., El Boubkari, K., Deletage, J-Y., Woirgard, E.

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New power module concept in PCB-embedded technology with silver sintering die attach von Tablati, A., Alayli, N., Youssef, T., Belnoue, O., Theolier, L., Woirgard, E.

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Mechanical stress investigation after technological process in Deep Trench Termination DT2 using BenzoCycloButene as dielectric material von Arbess, H., Baccar, F., Theolier, L., Azzopardi, S., Woirgard, E.

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Ageing mechanisms in Deep Trench Termination (DT2) Diode von Baccar, F., Arbess, H., Theolier, L., Azzopardi, S., Woirgard, E.

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A new junction termination technique: The Deep Trench Termination (DT2) von Theolier, L., Mahfoz-Kotb, H., Isoird, K., Morancho, F.

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Filling of very deep, wide trenches by BenzoCycloButene polymer von Mahfoz Kotb, Hicham Eldin, Isoird, K., Morancho, F., Théolier, L., Do Conto, T.

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Failure initiation of IGBT due to emitter contact degradation: A 2D finite elements electro-thermal multi-cell simulation approach under hard switching, short-circuit and avalanche... von El Boubkari, K., Azzopardi, S., Theolier, L., Roder, R., Woirgard, E., Bontemps, S.

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Feasibility study of a junction termination using deep trench isolation technique for the realization of DT-SJMOSFETs von Mahfoz-Kotb, H., Theolier, L., Morancho, F., Isoird, K., Dubreuil, P., Do Conto, T.

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Electrical characteristics evolution of the Deep Trench Termination diode based on a finite elements simulation approach von Baccar, F., Le Henaff, F., Theolier, L., Azzopardi, S., Woirgard, E.

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BJT application expansion by insertion of superjunction von Théolier, L, Benboujema, C, Schellmanns, A, Batut, N, Raingeaud, Y, Quoirin, J.-B

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BJT static behavior improvement by modification of the epitaxial layer von Theolier, L, Phung, L V, Batut, N, Schellmanns, A, Raingeaud, Y, Quoirin, J.-B

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2D finite elements electro-thermal modeling for IGBT: Uni and multicellular approach von El boubkari, K., Azzopardi, S., Theolier, L., Deletage, J. Y., Woirgard, E.

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Switching performance of 65 V vertical N-channel FLYMOSFETs von Théolier, L., Isoird, K., Tranduc, H., Morancho, F., Roig, J., Weber, Y., Stefanov, E.N., Reynès, J.-M.

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The Revival of Catholic Thought in France von Théolier, L. M.

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Switching performance of 65V vertical N-channel FLYMOSFETs von Théolier, L., Isoird, K., Tranduc, H., Morancho, F., Roig, J., Weber, Y., Stefanov, E.N., Reynès, J.-M.

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Sesame as an allergen in Lebanese food products: Occurrence, consumption and quantitative risk assessment von Touma, Joseph, Dominguez, Silvia, La Vieille, Sébastien, Remington, Benjamin C., Baumert, Joseph L., Théolier, Jérémie, Godefroy, Samuel Benrejeb

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FRANCE HERSELF AGAIN von Théolier, L. M.

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