Development of novel intermetallic joints using thin film indium based solder by low temperature bonding technology for 3D IC stacking von Choi, W.K., Premachandran, C.S., Chiew, O.S., Ling, X., Ebin, L., Khairyanto, A., Ratmin, B., Sheng, K.C.W., Thaw, P.P., Lau, J.H.

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Reliability Results of 0.8 mil Fine Pitch Copper wire bonding on Immersion Gold Plated Pad for Copper Low-k Devices von Leong Ching Wai, Xiaowu Zhang, Kripesh, V., Premachandran, C.S., Chong, S.C., Ying Ying Liu, Madhukumar, J., Srinivas, V.R., Thaw, P.P., Jong, M.J., Lau, J.H., Wang, S., Foo, C.K., Thew, M.L., Myo, E.P.P., Teo, W.L.

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