A low-power, high-speed, 9-channel germanium-silicon electro-absorption modulator array integrated with digital CMOS driver and wavelength multiplexer von Krishnamoorthy, A V, Zheng, X, Feng, D, Lexau, J, Buckwalter, J F, Thacker, H D, Liu, F, Luo, Y, Chang, E, Amberg, P, Shubin, I, Djordjevic, S S, Lee, J H, Lin, S, Liang, H, Abed, A, Shafiiha, R, Raj, K, Ho, R, Asghari, M, Cunningham, J E

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Chip-level waveguide-mirror-pillar optical interconnect structure von Ogunsola, O.O., Thacker, H.D., Bachim, B.L., Bakir, M.S., Pikarsky, J., Gaylord, T.K., Meindl, J.D.

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Sea of Leads (SoL) ultrahigh density wafer-level chip input/output interconnections for gigascale integration (GSI) von Bakir, M.S., Reed, H.A., Thacker, H.D., Patel, C.S., Kohl, P.A., Martin, K.P., Meindl, J.D.

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Ultralow Power 80 Gb/s Arrayed CMOS Silicon Photonic Transceivers for WDM Optical Links von Xuezhe Zheng, Liu, F. Y., Lexau, J., Patil, D., Guoliang Li, Ying Luo, Thacker, H. D., Shubin, I., Jin Yao, Raj, K., Ron Ho, Cunningham, J. E., Krishnamoorthy, A. V.

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2-pJ/bit (On-Chip) 10-Gb/s Digital CMOS Silicon Photonic Link von Xuezhe Zheng, Ying Luo, Lexau, J., Liu, F., Guoliang Li, Thacker, H. D., Shubin, I., Jin Yao, Ho, R., Cunningham, J. E., Krishnamoorthy, A. V.

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Silicon Photonic Interconnects for Large-Scale Computer Systems von Ho, Ron, Amberg, P., Chang, E., Koka, P., Lexau, J., Guoliang Li, Liu, F. Y., Schwetman, H., Shubin, I., Thacker, H. D., Xuezhe Zheng, Cunningham, J. E., Krishnamoorthy, A. V.

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Wafer-Testing of Optoelectonic-Gigascale CMOS Integrated Circuits von Thacker, H D, Ogunsola, O O, Muler, A V, Meindl, J D

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Sea-of-leads MEMS I/O interconnects for low-k IC packaging von Dang, B., Bakir, M.S., Patel, C.S., Thacker, H.D., Meindl, J.D.

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Thermal runaway prevention by control of float voltage as a function of a battery temperature von Thacker, H.D.

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Semi-sweet biscuits. Pt.1: the influence of sodium metabisulphite on dough rheology and baking performance von Oliver, G, Thacker |h D., Wheeler |h R. J.

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Sea of leads microwave characterization and process integration with FEOL and BEOL von Bakir, M.S., Thacker, H.D., Zhiping Zhou, Kohl, P.A., Martin, K.P., Meindl, J.D.

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Package demonstration of an interposer with integrated TSVs and flexible compliant interconnects von Shubin, I., Chow, E. M., Chow, A., De Bruyker, D., Thacker, H. D., Fujimoto, K., Raj, K., Krishnamoorthy, A. V., Mitchell, J. G., Cunningham, J. E.

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Assembly and alignment of Proximity Communication enabled multi-chip packages using elastomeric bump interposers von Hyung Suk Yang, Thacker, H. D., Shubin, I., Cunningham, J. E., Mitchell, J. G.

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"Dual-purpose" remateable Conductive Ball-in-Pit interconnects for chip powering and passive alignment in Proximity Communication enabled multi-chip packages von Thacker, H. D., Shubin, I., Ying Luo, Raj, K., Mitchell, J. G., Krishnamoorthy, A. V., Cunningham, J. E.

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Hybrid integration of silicon nanophotonics with 40nm-CMOS VLSI drivers and receivers von Thacker, H. D., Shubin, I., Ying Luo, Costa, J., Lexau, J., Xuezhe Zheng, Guoliang Li, Jin Yao, Jieda Li, Patil, D., Liu, F., Ho, R., Dazeng Feng, Asghari, M., Pinguet, T., Raj, K., Mitchell, J. G., Krishnamoorthy, A. V., Cunningham, J. E.

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Integrating through-silicon vias with solder free, compliant interconnects for novel, large area interposers von Shubin, I., Chow, E. M., Chow, A., Thacker, H. D., DeBruyker, D., Fujimoto, K., Raj, K., Krishnamoorthy, A. V., Mitchell, J. G., Cunningham, J. E.

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CMOS-photonic "macrochip" packaging von Thacker, H D, Shubin, I, Xuezhe Zheng, Costa, J, Ying Luo, Guoliang Li, Jin Yao, Jing Shi, Lexau, J, Ron Ho, Raj, K, Mitchell, J G, Cunningham, J E, Krishnamoorthy, A V

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High-density probe substrate for testing optical interconnects von Thacker, H.D., Ogunsola, O.O., Bakir, M.S., Meindl, J.D.

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Compliant probe substrates for testing high pin-count chip scale packages von Thacker, H.D., Bakir, M.S., Keezer, D.C., Martin, K.P., Meindl, J.D.

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American Society for Enhanced Recovery and Perioperative Quality Initiative Joint Consensus Statement on Nutrition Screening and Therapy Within a Surgical Enhanced Recovery Pathway von Wischmeyer, Paul E., Carli, Franco, Evans, David C., Guilbert, Sarah, Kozar, Rosemary, Pryor, Aurora, Thiele, Robert H., Everett, Sotiria, Grocott, Mike, Gan, Tong J., Shaw, Andrew D., Thacker, Julie K. M., Miller, Timothy E.

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