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  1. 1
    Incremental recrystallization/grain growth driven by elastic strain energy release in a thermomechanically fatigued lead-free solder joint

    Incremental recrystallization/grain growth driven by elastic strain energy release in a thermomechanically fatigued lead-free solder joint von Telang, A.U., Bieler, T.R., Zamiri, A., Pourboghrat, F.

    Veröffentlicht in Acta materialia

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  2. 2
    Characterization of microstructure and crystal orientation of the tin phase in single shear lap Sn–3.5Ag solder joint specimens

    Characterization of microstructure and crystal orientation of the tin phase in single shear lap Sn–3.5Ag solder joint specimens von Telang, A.U., Bieler, T.R.

    Veröffentlicht in Scripta materialia

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  3. 3
    Grain boundary sliding on near-7°, 14°, and 22° special boundaries during thermomechanical cycling in surface-mount lead-free solder joint specimens

    Grain boundary sliding on near-7°, 14°, and 22° special boundaries during thermomechanical cycling in surface-mount lead-free solder joint specimens von Telang, A.U., Bieler, T.R., Crimp, M.A.


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