Oxidation of ammonia using immobilised FeCu for water treatment von Chan, M.K., Abdullah, N., Rageh, E.H.A., Kumaran, P., Tee, Y.S.

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Reduced-complexity near-capacity downlink iteratively decoded generalized multi-layer space-time coding using irregular convolutional codes von Lingkun Kong, Soon Ng, Tee, R., Maunder, R., Hanzo, L.

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The positive mental health instrument: development and validation of a culturally relevant scale in a multi-ethnic Asian population von Vaingankar, Janhavi Ajit, Subramaniam, Mythily, Chong, Siow Ann, Abdin, Edimansyah, Orlando Edelen, Maria, Picco, Louisa, Lim, Yee Wei, Phua, Mei Yen, Chua, Boon Yiang, Tee, Joseph Y S, Sherbourne, Cathy

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EXIT-chart aided near-capacity Irregular Bit-Interleaved Coded Modulation design von Tee, R., Maunder, R.G., Hanzo, L.

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Multilevel generalised low-density parity-check codes von TEE, R. Y. S, KUO, F. C, HANZO, L

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Near-Capacity Irregular Bit-Interleaved Coded Modulation von Tee, R.Y.S., Maunder, R.G., Wang, J., Hanzo, L.

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Precoder-aided iterative detection assisted multilevel coding and three-dimensional EXIT-chart analysis von Tee, R.Y.S., Ng, S.X., Hanzo, L.

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Equivalent-Capacity-Based Design of Space-Time Block-Coded Sphere-Packing-Aided Multilevel Coding von Tee, R.Y.S., Alamri, O., Ng, S.X., Hanzo, L.

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Generalized Low-Density Parity-Check Coding Aided Multilevel Codes von Tee, R.Y.S., Kuo, F.C., Hanzo, L.

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Luby Transform Coding Aided Bit-Interleaved Coded Modulation for the Wireless Internet von Tee, R.Y.S., Nguyen, T.D., Ng, S.X., Yang, L.-L., Hanzo, L.

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In vitro antidermatophytic activity and cytotoxicity of extracts derived from medicinal plants and marine algae von Sit, N.W., Chan, Y.S., Lai, S.C., Lim, L.N., Looi, G.T., Tay, P.L., Tee, Y.T., Woon, Y.Y., Khoo, K.S., Ong, H.C.

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Near-mirror-finish phenomenon in EDM using powder-mixed dielectric von Wong, Y.S, Lim, L.C, Rahuman, Iqbal, Tee, W.M

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Treatment outcomes of T and natural‐killer/T‐cell lymphoma with ifosfamide, carboplatin and etoposide chemotherapy von Tay, Tricia, Somasundaram, Nagavalli, Lim, Cindy, Khoo, Lay Poh, Goh, Allan Zhi Kai, Lee, Yuh Shan, Liu, Xin, Tao, Miriam, Quek, Richard, Farid, Mohamad, Poon, Eileen, Chan, Jason Y. S., Chang, Esther W. Y., Yang, Valerie S. W., Goh, Yeow Tee, Tan, Daryl, Diong, Colin, Grigoropoulos, Nicholas F., Nagarajan, Chandramouli, Poon, Michelle, Mel, Sanjay, Jeyasekharan, Anand, Chan, Esther H. L., Lee, Joanne, Chee, Yen Lin, Lim, Soon Thye, Tang, Tiffany

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Wire Sweep Improvement Study for Fine Pitch Device von Liu, J.M., Yao, J.Z., Gao Wei, Lu, Y.S.

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Thermal Evaluation of Two Die Stacked FBGA Packages von Krishnamoorthi, S., Zhu, W.H., Wang, C.K., Tan, H.B., Sun, A.Y.S.

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Cyclic bend fatigue reliability investigation for Sn-Ag-Cu solder joints von Che, F.X., Pang, H.L.J., Zhu, W.H., Sun, A.Y.S.

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Bluetooth-enabled ECG Monitoring System von Kho, T.K., Besar, R., Tan, Y.S., Tee, K.H., Ong, K.C.

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Experimental and numerical assessment of board-level temperature cycling performance for PBGA, FBGA and CSP von Wei Sun, Zhu, W.H., Che, F.X., Wang, C.K., Sun, A.Y.S., Tan, H.B.

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On the thermal characterization of an exposed top quad flat no-lead package von Ma, Y.Y., Krishnamoorthi, S., Wang, C.K., Sun, A.Y.S., Zhu, W.H., Tan, H.B.

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High-speed differential interconnection design for flip-chip BGA packages von Yuan, W.L., Kuah, H.P., Wang, C.K., Sun, A.Y.S., Zhu, W.H., Tan, H.B., Muhamad, A.D.

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