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  1. 1
    Applicability Evaluation of Nano-Al2O3 Modified Sn-Ag-Cu Solder in High-Density Electronic Packaging Subjected to Thermal Cycling

    Applicability Evaluation of Nano-Al2O3 Modified Sn-Ag-Cu Solder in High-Density Electronic Packaging Subjected to Thermal Cycling von Wu, Jie, Huang, Guoqiang, Wu, Yiping, Huang, Xiwu, Yu, Rui, Yang, Xuqi, Chen, Guangyao, Tan, Cheelong, Yu, Zhihao, Sun, Huabin, Xu, Yong

    Veröffentlicht in Crystals (Basel)

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  2. 2
    Applicability Evaluation of Nano-Al[sub.2]O[sub.3] Modified Sn-Ag-Cu Solder in High-Density Electronic Packaging Subjected to Thermal Cycling

    Applicability Evaluation of Nano-Al[sub.2]O[sub.3] Modified Sn-Ag-Cu Solder in High-Density Electronic Packaging Subjected to Thermal Cycling von Wu, Jie, Huang, Guoqiang, Wu, Yiping, Huang, Xiwu, Yu, Rui, Yang, Xuqi, Chen, Guangyao, Tan, Cheelong, Yu, Zhihao, Sun, Huabin, Xu, Yong

    Veröffentlicht in Crystals (Basel)

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