Post Copper CMP Hybrid Clean Process for Advanced BEOL Technology von Wei-Tsu Tseng, Devarapalli, Vamsi, Steffes, James, Ticknor, Adam, Khojasteh, Mahmoud, Poloju, Praneetha, Goyette, Colin, Steber, David, Tai, Leo, Molis, Steven, Zaitz, Mary, Rill, Elliott, Kennett, Michael, Economikos, Laertis, Lustig, Naftali, Bunke, Christine, Truong, Connie, Chudzik, Michael, Grunow, Stephan

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Hybrid clean approach for post-copper CMP defect reduction von Wei-Tsu Tseng, Devarapalli, Vamsi, Steffes, James, Ticknor, Adam, Khojasteh, Mahmoud, Poloju, Praneetha, Goyette, Colin, Steber, David, Leo Tai, Molis, Steven, Zaitz, Mary, Rill, Elliott, Mittal, Surbhi, Kennett, Michael, Economikos, Laertis, Ouimet, George, Bunke, Christine, Truong, Connie, Grunow, Stephan, Chudzik, Michael

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Low Hydrogen Silicon Carbon Nitride Cap for High Performance Sub-10 nm Cu-Low k Interconnect von Nguyen, Son van, Shobha, Hosadurga k, Haigh, Thomas J, Yao, Yiping, Tai, Leo, Cohen, Stephan A, Shaw, Thomas M, Hu, Chao-kun, Liniger, Eric, Virwani, Kumar, Kellock, Andrew J, Canaperi, Donald F

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Atomic Layer Deposition of Sidewall Spacers: Process, Equipment and Integration Challenges in State-of-the-Art Logic Technologies von Belyansky, Michael P., Conti, Richard, Khan, Shahrukh, Zhou, Xin, Klymko, Nancy R, Yao, Yiping, Madan, Anita, Tai, Leo, Flaitz, Philip, Ando, Takashi

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Physical Mechanism of Threshold Voltage Modulation by Ge Channel Ion Implantation in the TiN/HfO 2 Gate Stack Systems von Tsuchiya, Yoshinori, Berliner, Nathaniel, Iijima, Ryosuke, Tai, Leo, Takayanagi, Mariko, Paruchuri, Vamsi

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Physical Mechanism of Threshold Voltage Modulation by Ge Channel Ion Implantation in the TiN/HfO 2 Gate Stack Systems von Tsuchiya, Yoshinori, Berliner, Nathaniel, Iijima, Ryosuke, Tai, Leo, Takayanagi, Mariko, Paruchuri, Vamsi

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Physical Mechanism of Threshold Voltage Modulation by Ge Channel Ion Implantation in the TiN/HfO2 Gate Stack Systems von Tsuchiya, Yoshinori, Berliner, Nathaniel, Iijima, Ryosuke, Tai, Leo, Takayanagi, Mariko, Paruchuri, Vamsi

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Post Cu CMP cleaning process evaluation for 32nm and 22nm technology nodes von Wei-Tsu Tseng, Canaperi, D., Ticknor, A., Devarapalli, V., Tai, L., Economikos, L., MacDougal, J., Bunke, C., Angyal, M., Muncy, J., Xiaomeng Chen, Zhang, J., Qiang Fang, Jianping Zheng

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Investigation of an on product high-k/metal metrology methodology using an in-line, high throughput XPS measurement technique von Min Dai, Klare, Mark, Rangarajan, Srinivasan, Chudzik, Michael P, Shepard, Joseph, Tai, Leo, Ronsheim, Paul, Kwan, Mike, Larson, Tom

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Macro-regenerative nodules in biliary atresia： CT/MRI findings and their pathological relations von Liang, Jiun-Lung, Cheng, Yu-Fan, Concejero, Allan-M, Huang, Tung-Liang, Chen, Tai-Yi, Tsang, Leo-Leung-Chit, Ou, Hsin-You

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Silicon Nitride Molecular Layer Deposition Process Development using Dichlorosilane and Ammonia von O'Meara, David L., Matsushita, Kaoru, Hasebe, Kazuhide, Dip, Anthony, Mo, Renee, Higgins, Paul, Maku, Shingo, Chudzik, Michael, Gribelyuk, Michael, Tai, Leo

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UV Cure Enabled Robust STI Oxide Gap Fill Solution for Thermally Limited Flow in Advanced Logic Devices von Mehta, Sanjay C, Conti, Richard, Devarajan, Thamarai, Wright, Matthew P, Yao, Yiping, Cohen, Stephan A, Ryan, Todd, Haigh, Thomas J, Hall, Paul, Canaperi, Donald F, Tai, Leo

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Low Hydrogen Silicon Carbon Nitride Cap for High Performance Sub-10 nm Cu-Low k Interconnect von Nguyen, Son van, Shobha, Hosadurga k, Haigh, Thomas J, Yao, Yiping, Tai, Leo, Cohen, Stephan A, Shaw, Thomas M, Hu, Chao-kun, Liniger, Eric, Virwani, Kumar, Kellock, Andrew J, Canaperi, Donald F

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Atomic Layer Deposition of Sidewall Spacers: Process, Equipment and Integration Challenges in State-of-the-Art Logic Technologies von Belyansky, Michael P., Conti, Richard, Khan, Shahrukh, Zhou, Xin, Klymko, Nancy R, Yao, Yiping, Madan, Anita, Tai, Leo, Flaitz, Philip, Ando, Takashi

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Interventional radiology in living donor liver transplant von Cheng, Yu-Fan, Ou, Hsin-You, Yu, Chun-Yen, Tsang, Leo Leung-Chit, Huang, Tung-Liang, Chen, Tai-Yi, Hsu, Hsien-Wen, Concerjero, Allan M, Wang, Chih-Chi, Wang, Shih-Ho, Lin, Tsan-Shiun, Liu, Yueh-Wei, Yong, Chee-Chien, Lin, Yu-Hung, Lin, Chih-Che, Chiu, King-Wah, Jawan, Bruno, Eng, Hock-Liew, Chen, Chao-Long

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Physical origin of pFET threshold voltage modulation by Ge channel ion implantation (GC-I/I) von Tsuchiya, Y, Berliner, N, Iijima, R, Monsieur, F, Tai, L, Loubet, N, Edge, L F, Takayanagi, M, Paruchuri, V

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Left-sided gallbladder： Its clinical significance and imaging presentations von Hsu, Sheng-Lung, Chen, Tai-Yi, Huang, Tung-Liang, Sun, Cheuk-Kwan, Concejero, Allan M, Tsang, Leo Leung Chit, Cheng, Yu-Fan

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Silicon Nitride Molecular Layer Deposition Process Development using Dichlorosilane and Ammonia von O'Meara, David L., Hasebe, Kazuhide, Dip, Anthony, Maku, Shingo, Matsushita, Kaoru, Mo, Renee, Higgins, Paul, Chudzik, Michael, Gribelyuk, Michael, Tai, Leo

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Copper interconnect structure and its formation von Nogami Takeshi, Tai Tsong Lin Leo, Edelstein Daniel, Parks Christopher

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COPPER INTERCONNECT STRUCTURE AND ITS FORMATION von NOGAMI TAKESHI, EDELSTEIN DANIEL, TAI TSONG LIN LEO, PARKS CHRISTOPHER

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