Advanced metallization schemes for bonding of InP-based laser devices to CVD-diamond heatsinks von Katz, A., Lee, C.H., Tai, K.L.

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System-In-Package (SIP): challenges and opportunities von Tai, K.L.

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Electromigration in conductor stripes under pulsed dc powering von English, A.T., Tai, K.L., Turner, P.A.

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Challenges and opportunities in packaging technology as ICs move toward deep sub-micron von Tai, K.L.

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Low cost, high volume applications to drive high performance Si-on-Si MCM von Tai, K.L.

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A dislocation dynamics study in alkali halides as revealed by deformation currents von Ohring, M, Tai, K.L, Machlin, E.S

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A new bare die test methodology von Zao Yang, Cheng, K.-T., Tai, K.L.

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Whisker growth in A1 thin films von Blech, I.A., Petroff, P.M., Tai, K.L., Kumar, V.

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Integration of large-scale FPGA and DRAM in a package using chip-on-chip technology von Wang, M.X., Suzuki, K., Dai, W.W.-M., Low, Y.L., O'Conner, K.J., Tai, K.L.

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A silicon-on-silicon MCM for voice recognition/telephone answering device von Han, B.J., Das, S., Frye, R.C., Tai, K.L., Lau, M.Y.

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AT&T spl mu/Surface Mount Assembly: A New Technology for the Large Volume Fabrication of Cost Effective Flip-Chip MCMs von Dudderar, T.D., Degani, Y., Spadafora, J.G., Tai, K.L., Frye, R.C.

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S parameter-based experimental modeling of high Q MCM inductor with exponential gradient learning algorithm von Jinsong Zhao, Frye, R.C., Dai, W.W.-M., Tai, K.L.

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Domain microscopy in chalcogenide alloy glass thin films von Chen, C.H., Phillips, J.C., Tai, K.L., Bridenbaugh, P.M.

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Lateral self-diffusion and electromigration in thin metal films von Tai, K.L., Sun, P.H., Ohring, M.

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Silicon-on-silicon MCMs with integrated passive components von Frye, R.C., Tai, K.L., Lau, M.Y., Lin, A.W.C.

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High Q-factor inductors integrated on MCM Si substrates von Zu, L., Yicheng Lu, Frye, R.C., Lau, M.Y., Chen, S.-C.S., Kossives, D.P., Jenshan Lin, Tai, K.L.

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Green function via moment matching for rapid and accurate substrate parasitics evaluation von Jinsong Zhao, Dai, W., Frye, R.C., Tai, K.L.

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Nonhermetic plastic packaging of high voltage electronic switches utilizing a low-stress glob coating for 95/5Pb/Sn solder joints of flip-chip bonded multichip module high voltage... von Ching Ping Wong, Segelken, J.M., Tai, K.L., Wong, C.C.

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Non-hermetic plastic packaging of high voltage electronic switches utilizing a low-stress glob coating for 95/5 Pb/Sn solder joints of flip-chip bonded multi-chip module high volta... von Wong, C.P., Segelken, J.M., Tai, K.L., Wong, C.C.

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Modeling and design considerations for embedded inductors in MCM-D von Jinsong Zhao, Dai, W., Frye, R.C., Tai, K.L.

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