Polarization Conversion of Light Diffracted from InP Nanowire Photonic Crystal Arrays von Tu, Chia‐Wei, Kaveh, Masoud, Fränzl, Martin, Gao, Qian, Tan, Hark Hoe, Jagadish, Chennupati, Schmitzer, Heidrun, Wagner, Hans Peter

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Dicing of composite substrate for thin film AlGaInP power LEDs by wet etching von Horng, Ray-Hua, Sinha, Shreekant, Tarntair, Fu-Gow, Feng, Hsiang-An, Tu, Chia-Wei

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Lasing from InP Nanowire Photonic Crystals on InP Substrate von Tu, Chia‐Wei, Fränzl, Martin, Gao, Qian, Tan, Hark‐Hoe, Jagadish, Chennupati, Schmitzer, Heidrun, Wagner, Hans Peter

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Sparse representation for image classification via paired dictionary learning von Wang, Hui-Hung, Tu, Chia-Wei, Chiang, Chen-Kuo

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Exercise Attenuates Intermittent Hypoxia-Induced Cardiac Fibrosis Associated with Sodium-Hydrogen Exchanger-1 in Rats von Chen, Tsung-I, Tu, Wei-Chia

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Two Benzene Rings with a Boron Atom Comprise the Core Structure of 2-APB Responsible for the Anti-Oxidative and Protective Effect on the Ischemia/Reperfusion-Induced Rat Heart Inju... von Shen, Yan-Cheng, Shen, Yan-Jhih, Lee, Wen-Sen, Chen, Michael Yu-Chih, Tu, Wei-Chia, Yang, Kun-Ta

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Unique reflection from birefringent uncoated and gold-coated InP nanowire crystal arrays von Tu, Chia-Wei, Kaveh, Masoud, Fränzl, Martin, Gao, Qian, Tan, Hark-Hoe, Jagadish, Chennupati, Schmitzer, Heidrun, Wagner, Hans Peter

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Comparison of Properties of Thin Film AlGaInP LEDs with Composite Metal and Si Substrates von Sinha, ShreeKant, Feng, Hsiang-An, Chung, Cheng-Yu, Tu, Chia-Wei, Horng, Ray-Hua

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Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices von Tu, Chia-Wei, Kuo, Yian-Liang, Wang, Yi-Sheng

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INTERCONNECT STRUCTURES, PACKAGED SEMICONDUCTOR DEVICES, AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES von Tu, Chia-Wei, Kuo, Yian-Liang, Wang, Yi-Sheng

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Plurality of different size metal layers for a pad structure von Tu, Chia-Wei, Yang, Ching-Jung, Chen, Hsien-Wei

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Plurality of Different Size Metal Layers for a Pad Structure von Tu, Chia-Wei, Yang, Ching-Jung, Chen, Hsien-Wei

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Plurality of different size metal layers for a pad structure von Tu, Chia-Wei, Yang, Ching-Jung, Chen, Hsien-Wei

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Magnetic light-emitting structure von Tu, Chia-Wei, Chen, Ya-Li, Feng, Hsiang-An, Chung, Cheng-Yu

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Reliability testing method and apparatus von Tu, Chia-Wei, Su, Shiang-Ruei, Lin, Liang-Chen

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Light-emitting diode packaging structure and method for fabricating the same von Liu, Ai Sen, Feng, Hsiang An, Tu, Chia Wei, Chen, Ya Li, Chung, Cheng Yu

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Magnetic light-emitting structure and fabrication method for manufacturing a magnetic light-emitting element von Tu, Chia-Wei, Chen, Ya-Li, Feng, Hsiang-An, Chung, Cheng-Yu

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Interconnect Structures, Packaged Semiconductor Devices, and Methods of Packaging Semiconductor Devices von Tu, Chia-Wei, Kuo, Yian-Liang, Wang, Yi-Sheng

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Alignment module for transferring a magnetic light-emitting die and alignment method thereof von Liu, Ai Sen, Feng, Hsiang An, Tu, Chia Wei, Chen, Ya Li

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Plurality of Different Size Metal Layers for a Pad Structure von Tu, Chia-Wei, Yang, Ching-Jung, Chen, Hsien-Wei

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