Comparative evaluation of methods to determine intra‐individual reference ranges in nutrition support team (NST)‐related tests von Hirabayashi, Yoji, Tsukada, Yutaka, Sakurai, Takuya, Ohno, Hideki, Kizaki, Takako

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Creep–fatigue life of Sn–8Zn–3Bi solder under multiaxial loading von Yamamoto, Takaei, Itoh, Takamoto, Sakane, Masao, Tsukada, Yutaka

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Packaging Substrate Applications of Ultra Low CTE Polyimide von Tsuchiya, Toshiyuki, Maeda, Satoshi, Tsukada, Yutaka

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Grain boundary sliding model for assessing creep-fatigue life of Sn37Pb eutectic solder von Sakane, Masao, Shiratsuchi, Takeshi, Tsukada, Yutaka

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Solder electromigration in Cu/In/Cu flip chip joint system von Yamanaka, Kimihiro, Tsukada, Yutaka, Suganuma, Katsuaki

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Expression Profile of a γ-Deletion Variant of the Human Telomerase Reverse Transcriptase Gene von Hisatomi, Hisashi, Ohyashiki, Kazuma, Ohyashiki, Junko H., Nagao, Kumi, Kanamaru, Taichi, Hirata, Hiroyuki, Hibi, Nozomu, Tsukada, Yutaka

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Antibody to human α-fetoprotein inhibits cell growth of human hepatocellular carcinoma cells by resuscitating the PTEN molecule: in vitro experiments von Ohkawa, Kiyoshi, Asakura, Tadashi, Tsukada, Yutaka, Matsuura, Tomokazu

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Increased serum levels of advanced glycation end-products and diabetic complications von Ono, Yuri, Aoki, Shin, Ohnishi, Katsunori, Yasuda, Takuzi, Katsumi Kawano, Tsukada, Yutaka

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Antibody to human [alpha]-fetoprotein inhibits cell growth of human hepatocellular carcinoma cells by resuscitating the PTEN molecule: in vitro experiments von Ohkawa, Kiyoshi, Asakura, Tadashi, Tsukada, Yutaka, Matsuura, Tomokazu

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Creep-Fatigue Life Evaluation for Sn-3.5Ag Solder von Nozaki, Mineo, Sakane, Masao, Tsukada, Yutaka, Nishimura, Hideo

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A Strain Rate Ratio Approach for Assessing Creep-Fatigue Life of 63Sn-37Pb Solder Under Shear Loading von Tsukada, Yutaka, Nishimura, Hideo, Yamamoto, Hiroki, Sakane, Masao

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Features of new laser micro-via organic substrate for semiconductor package von Tsukada, Yutaka, Yamanaka, Kimihior, Kodama, Yasushi, Kobayashi, Karu

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Studies on solder bump electromigration in Cu/Sn–3Ag–0.5Cu/Cu system von Yamanaka, Kimihiro, Tsukada, Yutaka, Suganuma, Katsuaki

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Effects of the crystallographic orientation of Sn on the electromigration of Cu/Sn–Ag–Cu/Cu ball joints von Lee, Kiju, Kim, Keun-Soo, Tsukada, Yutaka, Suganuma, Katsuaki, Yamanaka, Kimihiro, Kuritani, Soichi, Ueshima, Minoru

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Electromigration effect on solder bump in Cu/Sn–3Ag–0.5Cu/Cu system von Yamanaka, Kimihiro, Tsukada, Yutaka, Suganuma, Katsuaki

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SEWING MANAGEMENT SYSTEM von TSUKADA, Yutaka

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Influence of crystallographic orientation of Sn–Ag–Cu on electromigration in flip-chip joint von Lee, Kiju, Kim, Keun-Soo, Tsukada, Yutaka, Suganuma, Katsuaki, Yamanaka, Kimihiro, Kuritani, Soichi, Ueshima, Minoru

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Creepafatigue life of Sna8Zna3Bi solder under multiaxial loading von Yamamoto, Takaei, Itoh, Takamoto, Sakane, Masao, Tsukada, Yutaka

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Re-initiation Processes of Detonation Wave Behind Slit-Plate: Visualization of Re-initiation and Quenching Processes of Detonation Wave von OBARA, Tetsuro, TSUKADA, Yutaka, Sentanuhady, Jayan, OHYAGI, Shigeharu

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Fatigue Life Analysis of Solder Joints in Flip Chip Bonding von Tsukada, Yutaka, Nishimura, Hideo, Sakane, Masao, Ohnami, Masateru

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