Investigation of the Relationship between Whole-Wafer Strength and Control of Its Edge Engineering von Chen, Po-Ying, Tsai, Ming-Hsing, Yeh, Wen-Kuan, Jing, Ming-Haw, Chang, Yukon

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Relationship between wafer edge design and its ultimate mechanical strength von Chen, Po-Ying, Tsai, Ming-Hsing, Yeh, Wen-Kuan, Jing, Ming-Haw, Chang, Yukon

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Relationship between wafer fracture reduction and controlling during the edge manufacturing process von Chen, Po-Ying, Tsai, Ming-Hsing, Yeh, Wen-Kuan, Jing, Ming-Haw, Chang, Yukon

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Electrical characteristics and annealing study of boron-doped polycrystalline diamond films von SHENG-HSIUNG CHEN, SHEN-LI CHEN, MING-HSING TSAI, SHYU, J. J, CHIA-FU CHEN

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An efficient preclean of aluminized silicon substrate for chemical vapor deposition of submicron tungsten plugs von Yeh, Wen‐Kuan, Tsai, Ming‐Hsing, Chen, Sheng‐ Hsiung, Chen, Mao‐Chieh, Wang, Pei‐Jan, Liu, Lu‐Min, Lin, Mou‐Shiung

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An efficient improvement for barrier effect of W-filled contact von YEH, W.-K, CHAN, K.-Y, CHANG, T.-C, TSAI, M.-H, CHEN, S.-H, CHEN, M.-C, LIN, M.-S

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Excited-state charge coupled proton transfer reaction via the dipolar functionality of salicylideneaniline von Fang, Tzu-Chien, Tsai, Hsing-Yang, Luo, Ming-Hui, Chang, Che-Wei, Chen, Kew-Yu

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Improvement of selectivity during diamond growth utilizing a new process von Chen, Chia-Fu, Chen, Sheng-Hsiung, Hong, Tsao-Ming, Tsai, Ming-Hsing

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TUNGSTEN VIA FOR A MAGNETIC TUNNEL JUNCTION INTERCONNECT von LEE, Ya-Ling, TSAI, Ming-Hsing, CHIU, Wei-Gang

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Tungsten via for a magnetic tunnel junction interconnect von Tsai, Ming-Hsing, Chiu, Wei-Gang, Lee, Ya-Ling

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Contact conductive feature formation and structure von Tsai, Ming-Hsing, Tsai, Chun-I, Lin, Wei-Jung, Chang, Ken-Yu

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Chemical direct pattern plating method von Tsai, Ming-Hsing, Liu, Wen-Jiun, Kao, Chen-Yuan, Su, Hung-Wen, Jang, Syun-Ming

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Contact structure for semiconductor device and method von Tsai, Ming-Hsing, Chang, Chih-Wei, Chen, Hung-Hsu, Lin, Sheng-Hsuan, Tsai, Yan-Ming, Loh, Wei-Yip

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TUNGSTEN VIA FOR A MAGNETIC TUNNEL JUNCTION INTERCONNECT von LEE, Ya-Ling, TSAI, Ming-Hsing, CHIU, Wei-Gang

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rac- 11-t-Butoxy- 1,4-dihydro- 1,4-methanoanthracene： A two-dimensional framework structure built from C-H.-.O and C-H...п hydrogen bonds von Hsing Yang Tsai Ming Hui Luo Ming Jen Chang Tzu Chien Fang Kew Yu Chen

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METAL ADHESION LAYER TO PROMOTE METAL PLUG ADHESION von WANG, Yu-Sheng, WU, Pei-Wen, TSAI, Ming-Hsing, TSAI, Chun-I, HUNG, Chi-Cheng, SHEU, Jyh-Cherng

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Contact Conductive Feature Formation and Structure von Tsai, Ming-Hsing, Tsai, Chun-I, Lin, Wei-Jung, Chang, Ken-Yu

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Conductive feature formation and structure von Tsai, Ming-Hsing, Tsai, Chun-I, Lin, Wei-Jung, Wang, Yu Shih, Chang, Ken-Yu, Mao, Shian Wei

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Contact Plugs With Reduced R/C and the Methods of Forming The Same von Tsai, Ming-Hsing, Chang, Chih-Wei, Tsai, Chun-I, Wen, Yu-Ting, Yang, Kai-Chieh, Lo, Wei-Jen, Lin, Wei-Jung, Hung, Min-Hsiu, Jang, Syun-Ming

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SEMICONDUCTOR DEVICES AND METHOD OF FORMING THE SAME von Tsai, Ming-Hsing, Chang, Chih-Wei, Lin, Wei-Jung, Hsiao, Yu-Ting, Hung, Min-Hsiu

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