Metallization layer of an interconnect structure for a semiconductor die, method of fabricating the metallization layer, integrated circuit structure comprising the metallization l... von KANDAS, ANGELO W, HARAN, MOHIT K, DAS, RITESH K, SRIDHAR, DEEPAK, LIM, CHUL-HYUN, KIRBY, STEVEN D, TAN, ELLIOT N, BHIMARASETTI, GOPINATH, GULER, LEONARD P, TRIBATHI, ABHINAV, PARKER, JASON M, BELL, MARIE JUSTINE, PRINCE, MATTHEW J, GRANADOS ALPIZAR, BERNAL, ASORO, MICHAEL A, BUEHLER, MARK F, YEOH, ANDREW W, HARPER, MICHAEL K

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APPROACHES FOR PATTERNING METAL LINE ENDS FOR BACK END OF LINE (BEOL) INTERCONNECTS von LIM, Chul-Hyun, PARKER, Jason, M, HARPER, Michael, K, BUEHLER, Mark, F, GULER, Leonard, P, TRIBATHI, Abhinav, PRINCE, Matthew, J, SRIDHAR, Deepak, YEOH, Andrew, W, HARAN, Mohit, K, ASORO, Michael, A, BELL, Marie Justine, GRANADOS ALPIZAR, Bernal, BHIMARASETTI, Gopinath, KANDAS, Angelo, W, TAN, Elliot, N, KIRBY, Steven, D, DAS, Ritesh, K

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Metallizationlayer of an interconnct structure for a semiconductor die,method of fabricating the metallization layer,integrated circuit structure comprising the metallization layer... von KANDAS, ANGELO W, HARAN, MOHIT K, DAS, RITESH K, SRIDHAR, DEEPAK, LIM, CHUL-HYUN, KIRBY, STEVEN D, TAN, ELLIOT N, BHIMARASETTI, GOPINATH, GULER, LEONARD P, TRIBATHI, ABHINAV, PARKER, JASON M, BELL, MARIE JUSTINE, PRINCE, MATTHEW J, GRANADOS ALPIZAR, BERNAL, ASORO, MICHAEL A, BUEHLER, MARK F, YEOH, ANDREW W, HARPER, MICHAEL K

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Approaches for patterning metal line ends for back end of line (BEOL) interconnects von KANDAS, ANGELO W, HARAN, MOHIT K, DAS, RITESH K, SRIDHAR, DEEPAK, LIM, CHUL-HYUN, KIRBY, STEVEN D, TAN, ELLIOT N, BHIMARASETTI, GOPINATH, GULER, LEONARD P, TRIBATHI, ABHINAV, PARKER, JASON M, BELL, MARIE JUSTINE, PRINCE, MATTHEW J, GRANADOS ALPIZAR, BERNAL, ASORO, MICHAEL A, BUEHLER, MARK F, YEOH, ANDREW W, HARPER, MICHAEL K

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