Fully automated hot embossing processes utilizing high resolution working stamps von Glinsner, T., Veres, T., Kreindl, G., Roy, E., Morton, K., Wieser, T., Thanner, C., Treiblmayr, D., Miller, R., Lindner, P.

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Nanoimprint lithography from CHARPAN Tool exposed master stamps with 12.5 nm hp von MUEHIBERGER, M, BOEHM, M, PLATZGUMMER, E, LOESCHNER, H, JOECHL, P, EDER-KAPI, S, NARZT, T, LAUSECKER, E, FROMHERZ, T, BERGMAIR, I, CHOUIKI, M, SCHOEFTNER, R, KREINDL, G, KAST, M, TREIBLMAYR, D, GLINSNER, T, MILLER, R

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High accuracy UV-nanoimprint lithography step-and-repeat master stamp fabrication for wafer level camera application von Kreindl, G., Glinsner, T., Miller, R., Treiblmayr, D., Födisch, R.

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Fully automated hot embossing processes utilizing high resolution working stamps von Glinsner, T., Veres, T., Kreindl, G., Roy, E., Morton, K., Wieser, T., Thanner, C., Treiblmayr, D., Miller, R., Lindner, P.

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Nanoimprint lithography from CHARPAN Tool exposed master stamps with 12.5nmhp von Muehlberger, M., Boehm, M., Bergmair, I., Chouiki, M., Schoeftner, R., Kreindl, G., Kast, M., Treiblmayr, D., Glinsner, T., Miller, R., Platzgummer, E., Loeschner, H., Joechl, P., Eder-Kapl, S., Narzt, T., Lausecker, E., Fromherz, T.

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High accuracy step-and-repeat uv imprint lithography for wafer level camera master manufacturing von Kreindl, G, Glinsner, T, Födisch, R, Treiblmayr, D, Miller, R

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Fully automated hot embossing processes utilizing high resolutionworking stamps von Glinsner, T., Veres, T., Kreindl, G., Roy, E., Morton, K., Wieser, T., Thanner, C., Treiblmayr, D., Miller, R., Lindner, P.

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Fully automated hot embossing processes utilizing high resolution working stampsa von Glinsner, T., Veres, T., Kreindl, G., Roy, E., Morton, K., Wieser, T., Thanner, C., Treiblmayr, D., Miller, R., Lindner, P.

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