Neutralization of an epitaxial graphene grown on a SiC(0001) by means of palladium intercalation von Yagyu, Kazuma, Takahashi, Kazutoshi, Tochihara, Hiroshi, Tomokage, Hajime, Suzuki, Takayuki

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Fabrication of a single layer graphene by copper intercalation on a SiC(0001) surface von Yagyu, Kazuma, Tajiri, Takayuki, Kohno, Atsushi, Takahashi, Kazutoshi, Tochihara, Hiroshi, Tomokage, Hajime, Suzuki, Takayuki

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Process Feasibility and Reliability Performance of Fine Pitch Si Bare Chip Embedded in Through Cavity of Substrate Core von Younggun Han, Horiuchi, Osamu, Hayashi, Shigehiro, Nogita, Kanta, Katoh, Yoshihisa, Tomokage, Hajime

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Influence of uniaxial mechanical stress on the high frequency performance of metal-oxide-semiconductor field effect transistors on (100) Si wafer von Han, Younggun, Koganemaru, Masaaki, Ikeda, Toru, Miyazaki, Noriyuki, Choi, Woon, Tomokage, Hajime

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Evaluation of Relationship between Residual Stress on Chip Using Non-Conductive Film and Package Warpage Caused by Flip-Chip Bonding Process Using Test Element Group Chips with Pie... von Enami, Toshio, Horiuchi, Osamu, Han, Young-Gun, Tomokage, Hajime

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Evaluation of Electroplating Copper Filling of a Through Silicon Via Using a Scanning-laser-beam-induced Current System von Choi, Woon, Ishimoto, Takahiro, Tomokage, Hajime

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Welcome to your new journal von Tomokage, Hajime

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Evaluation of Stress Effects on Electrical Characteristics of N-Type MOSFETs: Variations of DC Characteristics During the Resin-Molding Process von Koganemaru, Masaaki, Ikeda, Toru, Miyazaki, Noriyuki, Tomokage, Hajime

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Evaluation of Ultrasonic Vibration Energy on Cu-Cu Direct Bonding for Flip-Chip Interconnection von Arai, Yoshiyuki, Nimura, Masatsugu, Tomokage, Hajime

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Evaluation of Residual Stress and Warpage of Device Embedded Substrates with Piezo-Resistive Sensor Silicon Chips von Han, Younggun, Horiuchi, Osamu, Hayashi, Shigehiro, Nogita, Kanta, Katoh, Yoshihisa, Nanami, Kyosuke, Tomokage, Hajime

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Evaluation of Residual Stress on Chip Using Capillary Underfill and Non-Conductive Film Caused by Flip-Chip Bonding Process Using Test Element Group Chips with Piezoresistive Senso... von Enami, Toshio, Nanami, Kyosuke, Horiuchi, Osamu, Han, Young-Gun, Tomokage, Hajime

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Effect of Direction of Ultrasonic Vibration on Flip-Chip Bonding von Masumoto, Mutsumi, Arai, Yoshiyuki, Tomokage, Hajime

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Experimental Study of Uniaxial-Stress Effects on DC Characteristics of nMOSFETs von Koganemaru, Masaaki, Ikeda, Toru, Miyazaki, Noriyuki, Tomokage, Hajime

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Identification of Through-Silicon Via (TSV) Failure Points Using the Time Domain Reflectometry (TDR) Method von Matsumoto, Keiji, Otsuka, Hiroaki, Horiuchi, Osamu, Han, Young Gun, Choi, Woon, Tomokage, Hajime

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The field emission properties of silicon carbide whiskers grown by CVD von Lim, Dong Chan, Ahn, Hyung Suk, Choi, Doo Jin, Wang, Chae Hyun, Tomokage, Hajime

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Bandpass Filter Embedded SwP (System with Probe) for High-Frequency Application von Matsumoto, Keiji, Saito, Ryota, Choi, Woon, Tomokage, Hajime

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Electron and laser beam-induced current measurements of diamond-like carbon films modified by scanning probe method von Hayashi, Shigehiro, Han, Younggun, Choi, Woon, Tomokage, Hajime

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Effective Diffusion Coefficient and Controlling Process of P Diffusion in Si Based on the Pair Diffusion Models of Vacancy and Interstitial Mechanisms von Masayuki Yoshida, Masayuki Yoshida, Masami Morooka, Masami Morooka, Manabu Takahashi, Manabu Takahashi, Hajime Tomokage, Hajime Tomokage

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Defect Analysis of High Electron Mobility Transistors Using a Scanning Electron and Laser Beams Induced Current (SELBIC) System von Sueyoshi, Haruki, Takasu, Shin-ichi, Choi, Woon, Tomokage, Hajime

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Device Simulation for Evaluating Effects of Inplane Biaxial Mechanical Stress on n-Type Silicon Semiconductor Devices von Koganemaru, M., Yoshida, K., Ikeda, T., Miyazaki, N., Tomokage, H.

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