Repairing chiplets and performance chiplets von PASDAST, GREGOR, TIAGELAOUI SAMIR NAZMUL, ELSHERBINI ADEL A

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Physical and electrical protocol conversion chiplet von KARNIK TANAY, SEIBOTH, J ¨ 1 RGEN, PASDAST, GREGOR, TIAGELAOUI SAMIR NAZMUL, KURIAN DIVYA, ELSHERBINI ADEL A

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Test and debug support with HBI chiplet architecture von KARNIK TANAY, STAFFORD KAREN, PASDAST, GREGOR, TIAGELAOUI SAMIR NAZMUL, MUNOZ RAFAEL, ELSHERBINI ADEL A

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Hopping level vias in metallization layers for integrated circuit devices von LIFF SHAWNA, PASDAST, GREGOR, TIAGELAOUI SAMIR NAZMUL, ELSHERBINI ADEL A, KOBRINSKY MAURO, SWAN JOHANNA

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Microelectronic die including exchangeable PHY circuitry and semiconductor package including same von QIAN ZHIGUO, SESHAN LOKESH, WU ZHIBIN, WANG PEGGY, DAS SHARMA DEBENDRA, NIMMAGADDA, SRIDHAR, PASDAST, GREGOR, TIAGELAOUI SAMIR NAZMUL, LANCA NICOLA, CHAUDHURI SURAJIT

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Selective routing through connection of inner bridging dies von QIAN ZHIGUO, SEARS SCOTT EDWARD, SWAN JOHANNA M, TIAGELAOUI SAMIR NAZMUL, ELSHERBINI ADEL A, LIFF SHAWNA M, PASDAST GERALD S, KOLLURU KRISHNA CHAITANYA, RAJAN VINOD KUMAR

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