Plasma application in atomic layer etching von Fischer, Andreas, Lill, Thorsten

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Thermal atomic layer etching: A review von Fischer, Andreas, Routzahn, Aaron, George, Steven M., Lill, Thorsten

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Overview of atomic layer etching in the semiconductor industry von Kanarik, Keren J., Lill, Thorsten, Hudson, Eric A., Sriraman, Saravanapriyan, Tan, Samantha, Marks, Jeffrey, Vahedi, Vahid, Gottscho, Richard A.

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Plasma sources for advanced semiconductor applications von Versolato, Oscar, Kaganovich, Igor, Bera, Kallol, Lill, Thorsten, Lee, Hyo-Chang, Hoekstra, Ronnie, Sheil, John, Nam, Sang Ki

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Thermal etching of AlF3 and thermal atomic layer etching of Al2O3 von Fischer, Andreas, Routzahn, Aaron, Lee, Younghee, Lill, Thorsten, George, Steven M.

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Predicting synergy in atomic layer etching von Kanarik, Keren J., Tan, Samantha, Yang, Wenbing, Kim, Taeseung, Lill, Thorsten, Kabansky, Alexander, Hudson, Eric A., Ohba, Tomihito, Nojiri, Kazuo, Yu, Jengyi, Wise, Rich, Berry, Ivan L., Pan, Yang, Marks, Jeffrey, Gottscho, Richard A.

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Directional etch of magnetic and noble metals. II. Organic chemical vapor etch von Chen, Jack Kun-Chieh, Altieri, Nicholas D., Kim, Taeseung, Chen, Ernest, Lill, Thorsten, Shen, Meihua, Chang, Jane P.

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Applying sputtering theory to directional atomic layer etching von Berry, Ivan L., Kanarik, Keren J., Lill, Thorsten, Tan, Samantha, Vahedi, Vahid, Gottscho, Richard A.

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Directional etch of magnetic and noble metals. I. Role of surface oxidation states von Chen, Jack Kun-Chieh, Altieri, Nicholas D., Kim, Taeseung, Lill, Thorsten, Shen, Meihua, Chang, Jane P.

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Neutral transport during etching of high aspect ratio features von Panagopoulos, Theodoros, Lill, Thorsten

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Ion Beam Patterning of High-Density STT-RAM Devices von Ip, Vincent, Shuogang Huang, Carnevale, Santino D., Berry, Ivan L., Rook, Katrina, Lill, Thorsten B., Paranjpe, Ajit P., Cerio, Frank

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Reducing damage to Si substrates during gate etching processes by synchronous plasma pulsing von Petit-Etienne, Camille, Darnon, Maxime, Vallier, Laurent, Pargon, Erwine, Cunge, Gilles, Boulard, François, Joubert, Olivier, Banna, Samer, Lill, Thorsten

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Highly Selective Directional Atomic Layer Etching of Silicon von Tan, Samantha, Yang, Wenbing, Kanarik, Keren J., Lill, Thorsten, Vahedi, Vahid, Marks, Jeff, Gottscho, Richard A.

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SiCl4/Cl2 plasmas: A new chemistry to etch high-k materials selectively to Si-based materials von Bodart, Paul, Cunge, Gilles, Joubert, Olivier, Lill, Thorsten

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Spontaneous Etching of Metal Fluorides Using Ligand-Exchange Reactions: Landscape Revealed by Mass Spectrometry von Lii-Rosales, Ann, Cavanagh, Andrew S, Fischer, Andreas, Lill, Thorsten, George, Steven M

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Causes of anisotropy in thermal atomic layer etching of nanostructures von Fischer, Andreas, Routzahn, Aaron, Wen, Sandy, Lill, Thorsten

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Volatile Products from Ligand Addition of P(CH 3 ) 3 to NiCl 2 , PdCl 2 , and PtCl 2 : Pathway for Metal Thermal Atomic Layer Etching von Lii-Rosales, Ann, Johnson, Virginia L., Sharma, Sandeep, Fischer, Andreas, Lill, Thorsten, George, Steven M.

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Surface reaction modelling of thermal atomic layer etching on blanket hafnium oxide and its application on high aspect ratio structures von Fischer, Andreas, Mui, David, Routzahn, Aaron, Gasvoda, Ryan, Sims, Jim, Lill, Thorsten

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Effectiveness of Different Ligands on Silane Precursors for Ligand Exchange to Etch Metal Fluorides von Lii-Rosales, Ann, Johnson, Virginia L., Cavanagh, Andrew S., Fischer, Andreas, Lill, Thorsten, Sharma, Sandeep, George, Steven M.

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Thermal Atomic Layer Etching of CoO, ZnO, Fe2O3, and NiO by Chlorination and Ligand Addition Using SO2Cl2 and Tetramethylethylenediamine von Partridge, Jonathan L., Murdzek, Jessica A., Johnson, Virginia L., Cavanagh, Andrew S., Fischer, Andreas, Lill, Thorsten, Sharma, Sandeep, George, Steven M.

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