Improving adhesion to copper interconnects in semiconductor devices von VINCENT JAMES MCGAHAY, HENRY NYE, JOYCE LIU, THOMAS HENRY IVERS

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Method for improving adhesion to copper von VINCENT JAMES MCGAHAY, HENRY NYE, THOMAS HENRY IVERS, JOYCE C LIU

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Laminated diffusion barrier von Barth, Edward Paul, Cohen, Stephan A, Dziobkowski, Chester, Fitzsimmons, John Anthony, Gates, Stephen McConnell, Ivers, Thomas Henry, Purushothaman, Sampath, Restaino, Darryl D, Wildman, Horatio Seymour

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Laminated diffusion barrier von FITZSIMMONS JOHN ANTHONY, BARTH EDWARD PAUL, IVERS THOMAS HENRY, COHEN STEPHAN A, RESTAINO DARRYL D, WILDMAN HORATIO SEYMOUR, PURUSHOTHAMAN SAMPATH, DZIOBKOWSKI CHESTER, GATES STEPHEN MCCONNELL

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Laminated diffusion barrier von FITZSIMMONS JOHN ANTHONY, BARTH EDWARD PAUL, IVERS THOMAS HENRY, COHEN STEPHAN A, RESTAINO DARRYL D, WILDMAN HORATIO SEYMOUR, PURUSHOTHAMAN SAMPATH, DZIOBKOWSKI CHESTER, GATES STEPHEN MCCONNELL

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Evaluating the effectiveness of a multifaceted intervention to reduce low-value care in adults hospitalized following trauma: a protocol for a pragmatic cluster randomized controll... von Moore, Lynne, Bérubé, Mélanie, Belcaid, Amina, Turgeon, Alexis F, Taljaard, Monica, Fowler, Robert, Yanchar, Natalie, Mercier, Éric, Paquet, Jérôme, Stelfox, Henry Thomas, Archambault, Patrick, Berthelot, Simon, Guertin, Jason R, Haas, Barbara, Ivers, Noah, Grimshaw, Jeremy, Lapierre, Alexandra, Ouyang, Yongdong, Sykes, Michael, Witteman, Holly, Lessard-Bonaventure, Paule, Gabbe, Belinda, Lauzier, François

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Method for improving adhesion to copper von Ivers, Thomas, Mcgahay, Vincent, Liu, Joyce, Nye, Henry

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Method for improving adhesion to copper von LIU JOYCE C, MCGAHAY VINCENT J, IVERS THOMAS H, NYE, III HENRY A

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Method for improving adhesion to copper von McGahay, Vincent J, Ivers, Thomas H, Liu, Joyce C, Nye, III, Henry A

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METHOD FOR IMPROVING ADHESION TO COPPER von THOMAS H. IVERS, JOYCE C. LUI, VINCENT J. MCGAHAY, HENRY A. NYE III

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Method for improving adhesion to copper von MCGAHAY VINCENT J, NYE HENRY A, LIU JOYCE, IVERS THOMAS H

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Method for improving adhesion to copper von LIU, JOYCE C, IVERS, THOMAS H, MCGAHAY, VINCENT J, NYE III, HENRY A

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Method for improving adhesion to copper von LIU JOYCE C, MCGAHAY VINCENT J, IVERS THOMAS H, NYE, III HENRY A

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SEMICONDUCTOR DEVICE CONTAINING COPPER MEMBER AND ITS MANUFACTURE von VINCENT J MAKUGAHEI, HENRY A NIE III, THOMAS H IVERS, JOYCE C RIEU

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