Adhesion Phenomena Pertaining to Thermal Interface Materials and Solder Interconnects in Microelectronic Packaging: A Critical Review von Thanu, Dinesh P R, Antoniswamy, Aravindha, Danaei, Roozbeh, Keswani, Manish

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Adhesion Enhancement of Polymer Surfaces by Ion Beam Treatment: A Critical Review von Srinadhu, Endu Sekhar, Shyam, Radhey, Kumar, Jatinder, Thanu, Dinesh P R, Zhao, Mingrui, Keswani, Manish

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Thermal Interface Materials and Cooling Technologies in Microelectronic Packaging—A Critical Review von Thanu, Dinesh P. R., Liu, Boxi, Cartas, Marco Aurelio

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Heat spreader edge standoffs for managing bondline thickness in microelectronic packages von Raravikar, Nachiket R, Jain, Syadwad, Dhavaleswarapu, Hemanth K, Beatty, John J, Thanu, Dinesh P. R

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HEAT SPREADER EDGE STANDOFFS FOR MANAGING BONDLINE THICKNESS IN MICROELECTRONIC PACKAGES von Raravikar, Nachiket R, Jain, Syadwad, Dhavaleswarapu, Hemanth K, Beatty, John J, Thanu, Dinesh P. R

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Heat spreader edge standoffs for managing bondline thickness in microelectronic packages von Raravikar, Nachiket R, Jain, Syadwad, Dhavaleswarapu, Hemanth K, Beatty, John J, Thanu, Dinesh P. R

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Standoff spacers for managing bondline thickness in microelectronic packages von Deshmukh, Sachin, Dhavaleswarapu, Hemanth K, Beatty, John J, Thanu, Dinesh P. R

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HEAT SPREADER EDGE STANDOFFS FOR MANAGING BONDLINE THICKNESS IN MICROELECTRONIC PACKAGES von RARAVIKAR, Nachiket R, THANU, Dinesh P. R, DHAVALESWARAPU, Hemanth K, BEATTY, John J, JAIN, Syadwad

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HEAT SPREADER EDGE STANDOFFS FOR MANAGING BONDLINE THICKNESS IN MICROELECTRONIC PACKAGES von Raravikar, Nachiket R, Jain, Syadwad, Dhavaleswarapu, Hemanth K, Beatty, John J, Thanu, Dinesh P. R

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STANDOFF SPACERS FOR MANAGING BONDLINE THICKNESS IN MICROELECTRONIC PACKAGES von Deshmukh, Sachin, Dhavaleswarapu, Hemanth K, Beatty, John J, Thanu, Dinesh P. R

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STANDOFF SPACERS FOR MANAGING BONDLINE THICKNESS IN MICROELECTRONIC PACKAGES von DINESH P. R. THANU, HEMANTH K. DHAVALESWARAPU, SACHIN DESHMUKH, JOHN J. BEATTY

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Dilute HF Solutions for Copper Cleaning during BEOL Processes: Effect of Aeration on Selectivity and Copper Corrosion von Padmanabhan Ramalekshmi Thanu, Dinesh, Venkataraman, Nandini, Raghavan, Srini, Mahdavi, Omid

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