Treffer 1 - 14 von 14 für Suche 'TEIXEIRA DE QUEIROS, Alberto Jose', Suchdauer: 0,52s Treffer weiter einschränken
  1. 1
    Dissipador de calor de matriz de alta potência com pino de calor vertical

    Dissipador de calor de matriz de alta potência com pino de calor vertical von VALTERE MARKUS, KASSTEEN BART, ALBERTO JOSE TEIXEIRA DE QUEIROS, MOREIRA JOSE

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  2. 2
    High-power die heat sink with vertical heat path

    High-power die heat sink with vertical heat path von Kassteen, Bart, Teixeira De Queiros, Alberto Jose, Moreira, Jose, Valtere, Markus

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  3. 3
    PACOTE COMPREENDENDO UM SUBSTRATO, UM DISPOSITIVO INTEGRADO E UMA CAMADA DE ENCAPSULAMENTO COM REBAIXAMENTO

    PACOTE COMPREENDENDO UM SUBSTRATO, UM DISPOSITIVO INTEGRADO E UMA CAMADA DE ENCAPSULAMENTO COM REBAIXAMENTO von ALBERTO JOSE TEIXEIRA DE QUEIROS, ANDREAS FRANZ, CLAUS REITLINGER, ANNA KATHARINA KREFFT

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  4. 4
    Package comprising a substrate, an integrated device, and an encapsulation layer with undercut

    Package comprising a substrate, an integrated device, and an encapsulation layer with undercut von Teixeira De Queiros, Alberto Jose, Krefft, Anna Katharina, Franz, Andreas, Reitlinger, Claus

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  5. 5
    HIGH POWER DIE HEAT SINK WITH VERTICAL HEAT PIN

    HIGH POWER DIE HEAT SINK WITH VERTICAL HEAT PIN von VALTERE, Markus, MOREIRA, Jose, KASSTEEN, Bart, TEIXEIRA DE QUEIROS, Alberto Jose

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  6. 6
    PACKAGE COMPRISING A SUBSTRATE, AN INTEGRATED DEVICE, AND AN ENCAPSULATION LAYER WITH UNDERCUT

    PACKAGE COMPRISING A SUBSTRATE, AN INTEGRATED DEVICE, AND AN ENCAPSULATION LAYER WITH UNDERCUT von REITLINGER, Claus, FRANZ, Andreas, KREFFT, Anna Katharina, TEIXEIRA DE QUEIROS, Alberto Jose

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  7. 7
    HIGH-POWER DIE HEAT SINK WITH VERTICAL HEAT PATH

    HIGH-POWER DIE HEAT SINK WITH VERTICAL HEAT PATH von VALTERE, Markus, MOREIRA, Jose, KASSTEEN, Bart, TEIXEIRA DE QUEIROS, Alberto Jose

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  8. 8
    HIGH POWER DIE HEAT SINK WITH VERTICAL HEAT PIN

    HIGH POWER DIE HEAT SINK WITH VERTICAL HEAT PIN von VALTERE, Markus, MOREIRA, Jose, KASSTEEN, Bart, TEIXEIRA DE QUEIROS, Alberto Jose

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  9. 9
    PACKAGE COMPRISING A SUBSTRATE, AN INTEGRATED DEVICE, AND AN ENCAPSULATION LAYER WITH UNDERCUT

    PACKAGE COMPRISING A SUBSTRATE, AN INTEGRATED DEVICE, AND AN ENCAPSULATION LAYER WITH UNDERCUT von REITLINGER, Claus, FRANZ, Andreas, KREFFT, Anna Katharina, TEIXEIRA DE QUEIROS, Alberto Jose

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  10. 10
    PACKAGE COMPRISING A SUBSTRATE, AN INTEGRATED DEVICE, AND AN ENCAPSULATION LAYER WITH UNDERCUT

    PACKAGE COMPRISING A SUBSTRATE, AN INTEGRATED DEVICE, AND AN ENCAPSULATION LAYER WITH UNDERCUT von REITLINGER, Claus, FRANZ, Andreas, KREFFT, Anna Katharina, TEIXEIRA DE QUEIROS, Alberto Jose

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  11. 11
    수직 히트 핀을 갖는 고전력 다이 히트 싱크

    수직 히트 핀을 갖는 고전력 다이 히트 싱크 von VALTERE MARKUS, KASSTEEN BART, MOREIRA JOSE, TEIXEIRA DE QUEIROS ALBERTO JOSE

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  12. 12
    기판, 집적 디바이스, 및 언더컷이 있는 캡슐화 층을 포함하는 패키지

    기판, 집적 디바이스, 및 언더컷이 있는 캡슐화 층을 포함하는 패키지 von KREFFT ANNA KATHARINA, REITLINGER CLAUS, FRANZ ANDREAS, TEIXEIRA DE QUEIROS ALBERTO JOSE

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  13. 13
    High-power die heat sink with vertical heat path

    High-power die heat sink with vertical heat path von TEIXEIRA DE QUEIROS, ALBERTO JOSE, VALTERE, MARKUS, KASSTEEN, BART, MOREIRA, JOSE

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  14. 14
    Package comprising a substrate, an integrated device, and an encapsulation layer with undercut

    Package comprising a substrate, an integrated device, and an encapsulation layer with undercut von TEIXEIRA DE QUEIROS, ALBERTO JOSE, FRANZ, ANDREAS, REITLINGER, CLAUS, KREFFT, ANNA KATHARINA

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