A SiGe BiCMOS Transmitter/Receiver Chipset With On-Chip SIW Antennas for Terahertz Applications von Sanming Hu, Yong-Zhong Xiong, Bo Zhang, Lei Wang, Teck-Guan Lim, Minkyu Je, Madihian, M.

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Compact High-Gain mmWave Antenna for TSV-Based System-in-Package Application von Hu, Sanming, Xiong, Yong-Zhong, Wang, Lei, Li, Rui, Shi, Jinglin, Lim, Teck-Guan

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Compact Wideband Equivalent-Circuit Model for Electrical Modeling of Through-Silicon Via von LIU, En-Xiao, LI, Er-Ping, EWE, Wei-Bin, HUI MIN LEE, TECK GUAN LIM, SHAN GAO

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Millimeter-Wave Frequency Doubler With Transistor Grounded-Shielding Structure in 0.13-μm SiGe BiCMOS Technology von LEI WANG, XIONG, Yong-Zhong, BO ZHANG, HU, San-Ming, LIM, Teck-Guan

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0.7-dB Insertion-Loss D-Band Lange Coupler Design and Characterization in 0.13 μm SiGe BiCMOS Technology von Wang, Lei, Xiong, Yong-Zhong, Zhang, Bo, Hu, San-Ming, Lim, Teck-Guan, Yuan, Xiao-Jun

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Embedded Wafer Level Packaging for 77-GHz Automotive Radar Front-End With Through Silicon Via and its 3-D Integration von Li, Rui, Jin, Cheng, Ong, Siong Chiew, Lim, Teck Guan, Chang, Ka Fai, Ho, Soon Wee

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Ka-band CPW-to-slotline transition in photoimageable thick film technology for tapered slot antenna applications von Lim, Teck-Guan, Ang, Hwee-Ngoh, Robertson, Ian D., Weiss, Bernard L.

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TSV Technology for Millimeter-Wave and Terahertz Design and Applications von Hu, Sanming, Wang, Lei, Xiong, Yong-Zhong, Lim, Teck Guan, Zhang, Bo, Shi, Jinglin, Yuan, Xiaojun

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273-GHz 2X Subharmonic Up-Conversion Mixer for System-on-Package Applications von Li, Rui, Lim, Teck Guan, Ho, Soon Wee

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A D-BAND POWER AMPLIFIER WITH 30-GHZ BANDWIDTH AND 4.5-DBM PSAT FOR HIGH-SPEED COMMUNICATION SYSTEM von Zhang, Bo, Xiong, Yong-Zhong, Wang, Lei, Hu, Sanming, Lim, Teck-Guan, Zhuang, Yi-Qi, Li, Le-Wei

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1.6 Tbps FOWLP-Based Silicon Photonic Engine for Co-Packaged Optics von Li, Xin, Gourikutty, Sajay Bhuvanendran Nair, Wu, Jiaqi, Lim, Teck Guan, Guo, Pengfei, Davies, Jaye Charles, Koh, Edward Sing Chee, Lau, Boon Long, Jong, Ming Chinq, Chong, Ser Choong, Sandra, San, Li, Chao, Lo, Guo-Qiang, Bhattacharya, Surya, Liow, Jason Tsung-Yang

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Demonstration of Direct Coupled Optical/Electrical Circuit Board von Teck Guan Lim, Ramana, P.V., Lee, B.S.P., Shioda, T., Kuruveettil, H., Jing Li, Suzuki, K., Fujita, K., Yamada, K., Pinjala, D., Shing, J.L.H.

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Development of Optical MUX/DEMUX on Silicon Optical Bench-Assembly Accuracies von Chee-Wei Tan, Teck-Guan Lim, Jing Li, Endrio, T.G., Yi-Yoon Chai, Maruo, S., Ramana, P.V., Seung-Wook Yoon, Lau, J.H.

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The design of broadband 3D Si-based directional couplers for millimeter-wave/THz applications von Jiankang Li, Yong-Zhong Xiong, Debin Hou, Teck-Guan Lim, Tang Min, Wang Ling Goh, Wen Wu

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77-GHz Automotive Radar Sensor System With Antenna Integrated Package von Chang, Ka Fai, Li, Rui, Jin, Cheng, Lim, Teck Guan, Ho, Soon Wee, Hwang, How Yuan, Zheng, Boyu

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Millimeter-Wave Frequency Doubler With Transistor Grounded-Shielding Structure in hbox 0.13 - mu hbox m SiGe BiCMOS Technology von Wang, Lei, Xiong, Yong-Zhong, Zhang, Bo, Hu, San-Ming, Lim, Teck-Guan

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Millimeter-Wave Frequency Doubler With Transistor Grounded-Shielding Structure in [Formula Omitted] SiGe BiCMOS Technology von Wang, Lei, Xiong, Yong-Zhong, Zhang, Bo, Hu, San-Ming, Lim, Teck-Guan

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A 434GHz SiGe BiCMOS transmitter with an on-chip SIW slot antenna von Sanming Hu, Lei Wang, Yong Zhong Xiong, Bo Zhang, Teck Guan Lim

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A 77-135GHz down-conversion IQ mixer for 10Gbps multiband applications von Sanming Hu, Yong-Zhong Xiong, Lei Wang, Jinglin Shi, Teck-Guan Lim

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High Quality and Low Loss Millimeter Wave Passives Demonstrated to 77-GHz for SiP Technologies Using Embedded Wafer-Level Packaging Platform (EMWLP) von Ying Ying Lim, Xianghua Xiao, Vempati, Srinivasa Rao, Su, Nandar, Kumar, Aditya, Sharma, Gaurav, Teck Guan Lim, Vaidyanathan, Kripesh, Jinglin Shi, Lau, John H, Shiguo Liu

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