Anisotropic highly conductive joints utilizing Cu-solder microcomposite structure for high-temperature electronics packaging von Tatsumi, Hiroaki, Nishikawa, Hiroshi

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Impact of crystalline orientation on Cu–Cu solid-state bonding behavior by molecular dynamics simulations von Tatsumi, Hiroaki, Kao, C. R., Nishikawa, Hiroshi

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Fabrication and thermo-mechanical properties of Ag9In4 intermetallic compound von Liu, Xunda, Tatsumi, Hiroaki, Jin, Zhi, Chen, Zhong, Nishikawa, Hiroshi

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Solid-state bonding behavior between surface-nanostructured Cu and Au: a molecular dynamics simulation von Tatsumi, Hiroaki, Kao, C. R., Nishikawa, Hiroshi

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Quasi-direct Cu–Si3N4 bonding using multi-layered active metal deposition for power-module substrate von Tatsumi, Hiroaki, Moon, Seongjae, Takahashi, Makoto, Kozawa, Takahiro, Tsushima, Eiki, Nishikawa, Hiroshi

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Thermomechanical Properties of Zeta (Ag3In) Phase von Liu, Xunda, Tatsumi, Hiroaki, Jin, Zhi, Chen, Zhong, Nishikawa, Hiroshi

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A Comparative Numerical Study of Thermo-Mechanical Behavior among Various IMC Joints under Thermal Cycling Condition von LIU, Xunda, TATSUMI, Hiroaki, NISHIKAWA, Hiroshi

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Pressureless sinter joining of bare Cu substrates under forming gas atmosphere by surface-oxidized submicron Cu particles von Yamagiwa, Daiki, Matsuda, Tomoki, Furusawa, Hideki, Sato, Kenji, Tatsumi, Hiroaki, Sano, Tomokazu, Kashiba, Yoshihiro, Hirose, Akio

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Comparative Study of Sn-based Solder Wettability on Aluminum Substrate von Li, Jiahui, Tatsumi, Hiroaki, Nishikawa, Hiroshi

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Bonding through novel solder-metallic mesh composite design von Lis, Adrian, Tatsumi, Hiroaki, Matsuda, Tomoki, Sano, Tomokazu, Kashiba, Yoshihiro, Hirose, Akio

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Evolution of Transient Liquid-Phase Sintered Cu–Sn Skeleton Microstructure During Thermal Aging von Tatsumi, Hiroaki, Lis, Adrian, Yamaguchi, Hiroshi, Matsuda, Tomoki, Sano, Tomokazu, Kashiba, Yoshihiro, Hirose, Akio

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Reliability and Temperature Resistance of Solder–Metallic Mesh Composite Joints von Lis, Adrian, Tatsumi, Hiroaki, Matsuda, Tomoki, Sano, Tomokazu, Kashiba, Yoshihiro, Hirose, Akio

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Evaluation of Stiffness-Reduced Joints by Transient Liquid-Phase Sintering of Copper-Solder-Resin Composite for SiC Die-Attach Applications von Tatsumi, Hiroaki, Lis, Adrian, Yamaguchi, Hiroshi, Kashiba, Yoshihiro, Hirose, Akio

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Utility of 12-lead and signal-averaged Holter electrocardiograms after pilsicainide provocation for risk stratification in Brugada syndrome von Kakihara, Jun, Takagi, Masahiko, Hayashi, Yusuke, Tatsumi, Hiroaki, Doi, Atsushi, Yoshiyama, Minoru

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マイクロ接合向け固相接合挙動に関する分子動力学シミュレーション von 巽, 裕章

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Diagnostic value of electrocardiographic P-wave characteristics in atrial fibrillation recurrence and tachycardia-induced cardiomyopathy after catheter ablation von Doi, Atsushi, Takagi, Masahiko, Katayama, Hisashi, Yoshiyama, Tomotaka, Hayashi, Yusuke, Tatsumi, Hiroaki, Yoshiyama, Minoru

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Deformation Behavior of Transient Liquid-Phase Sintered Cu-Solder-Resin Microstructure for Die-Attach von Tatsumi, Hiroaki, Yamaguchi, Hiroshi, Matsuda, Tomoki, Sano, Tomokazu, Kashiba, Yoshihiro, Hirose, Akio

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Successful catheter ablation improves exercise tolerance in persistent atrial fibrillation patients, especially those with reduced ventricular contraction, preserved atrial functio... von Katayama, Hisashi, Shibata, Atsushi, Doi, Atsushi, Ishikawa, Hirotoshi, Tamura, Shota, Yamaguchi, Yumi, Matsuo, Masanori, Yoshiyama, Tomotaka, Tatsumi, Hiroaki, Iwata, Shinichi, Ehara, Shoichi, Izumiya, Yasuhiro, Yoshiyama, Minoru

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Utility of T-wave alternans during night time as a predictor for ventricular fibrillation in patients with Brugada syndrome von Sakamoto, Shogo, Takagi, Masahiko, Tatsumi, Hiroaki, Doi, Atsushi, Sugioka, Kenichi, Hanatani, Akihisa, Yoshiyama, Minoru

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Successful Radiofrequency Catheter Ablation for Electrical Storm of Ventricular Fibrillation in a Patient With Brugada Syndrome von Nakagawa, Eiichiro, Takagi, Masahiko, Tatsumi, Hiroaki, Yoshiyama, Minoru

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