Impact of Packaging Design on Reliability of Large Die Cu/Low- \kappa (BD) Interconnect von Chai, T. C., Zhang, X., Li, H. Y., Sekhar, V. N., Khan, O. K. N., Lau, J., Murthy, R., Yeow Meng Tan, Cheng, C. K., Siao Li Liew, Dongzhi Chi

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Assembly challenges of high density large fine pitch lead-free flip chip package von Ser Choong Chong, Yeow Meng Tan, Tai Chong Chai, Lim, S., Wai Yin Hnin, Chek Kweng Chen

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Impact of Packaging Design on Reliability of Large Die Cu/Low-[Formula Omitted] (BD) Interconnect von Chai, Tai Chong, Zhang, Xiaowu, Li, Hong Yu, Sekhar, Vasarla Nagendra, Khan, Oratti Kalandar Navas, Lau, John, Murthy, Ramana, Tan, Yeow Meng, Cheng, Chek Kweng, Liew, Siao Li, Chi, Dongzhi

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Investigation of weight-on-wheel switch failure in F-16 aircraft von Tan, Cher Ming, Ang, Kok Meng, Tay, Liang Huat, Meng, Tan Yeow

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Reliability assessment of high density fine pitch lead-free flip chip package von Ser Choong Chong, Simon Ting, Tan Yeow Meng, Chai Tai Chong, Srinivasamurthy Sampath, Hnin Wai Yin, Lim, S., Cheng Chek Kweng

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A PACKAGING APPARATUS AND METHOD FOR TRANSFERRING INTEGRATED CIRCUITS TO A PACKAGING von NG, CHIN SIN, TAN, MENG YEOW, CHANG, SING KEONG

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AN APPARATUS AND METHOD FOR INSPECTING AN OBJECT von ADITYA, SINGH, DESMOND, TOH, EDDIE, CHANG, TAN MENG, YEOW, SHAILESH, SUBANNA, THOMAS, HEI, WILSON, CHIA

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A PACKAGING APPARATUS AND METHOD FOR TRANSFERRING INTEGRATED CIRCUITS TO A PACKAGING von NG CHIN SIN, TAN MENG YEOW, CHANG SING KEONG

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A PACKAGING APPARATUS AND METHOD FOR TRANSFERRING INTEGRATED CIRCUITS TO A PACKAGING von NG, CHIN SIN, TAN, MENG YEOW, CHANG, SING KEONG

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Digital image correlation and its applications in electronics packaging von Sun Yaofeng, Tan Yeow Meng, Pang, J.H.L., Su Fei

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A packaging apparatus and method for transferring integrated circuits to a packaging von NG, CHIN SIN, TAN, MENG YEOW, CHANG, SING KEONG

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AN APPARATUS AND METHOD FOR INSPECTING AN OBJECT von CHIA, WILSON, HEI, THOMAS, CHANG, EDDIE, SUBANNA, SHAILESH, TOH, DESMOND, YEOW, TAN MENG, SINGH, ADITYA

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METHOD FOR JOINING AN INTEGRATED CIRCUIT AND A FLEXIBLE CIRCUIT von TSUI CHRISTINA CHUNG MAN, FEIGENBAUM HAIM, WANG ZHIPING, MENG TAN YEOW, SCHREIBER CHRIS M

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METHOD FOR JOINING AN INTEGRATED CIRCUIT AND A FLEXIBLE CIRCUIT von TSUI CHRISTINA CHUNG MAN, FEIGENBAUM HAIM, WANG ZHIPING, MENG TAN YEOW, SCHREIBER CHRIS M

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METHOD FOR JOINING AN INTEGRATED CIRCUIT AND A FLEXIBLE CIRCUIT von TSUI CHRISTINA CHUNG MAN, FEIGENBAUM HAIM, WANG ZHIPING, MENG TAN YEOW, SCHREIBER CHRIS M

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An apparatus and method for inspecting an object von CHIA, WILSON, HEI, THOMAS, TAN, MENG YEOW, CHANG, EDDIE, SUBANNA, SHAILESH, TOH, DESMOND, SINGH, ADITYA

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Method for joining an integrated circuit and a flexible circuit von SCHREIBER, CHRIS, M, TSUI CHRISTINA CHUNG MAN, FEIGENBAUM HAIM, WANG ZHIPING, TAN YEOW MENG

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A packaging apparatus and method for transferring integrated circuits to a packaging von NG, CHIN SIN, TAN, MENG YEOW, CHANG, SING KEONG

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Method for joining an integrated circuit and a flexible circuit von YEOW, MENG TAN, WANG, ZHIPING, FEIGENBAUM, HAIM, SCHREIBER, CHRIS M, CHUNG, MAN TSUI CHRISTINA

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Joining an IC and flexible circuit by contact bumps von CHRIS M SCHREIBER, HAIM FEIGENBAUM, CHRISTINE CHUNG MAN TSUI, TAN YEOW MENG, ZHIPNG WANG

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