Impact of SiO2 on Al-Al thermocompression wafer bonding von Malik, Nishant, Schjølberg-Henriksen, Kari, Poppe, Erik U, Taklo, Maaike M V, Finstad, Terje G

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Wafer-level Au-Au bonding in the 350-450 °C temperature range von Tofteberg, Hannah R, Schjølberg-Henriksen, Kari, Fasting, Eivind J, Moen, Alexander S, Taklo, Maaike M V, Poppe, Erik U, Simensen, Christian J

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3D System-on-Chip technologies for More than Moore systems von Ramm, Peter, Klumpp, Armin, Weber, Josef, Taklo, Maaike M. V.

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Strong, high-yield and low-temperature thermocompression silicon wafer-level bonding with gold von Taklo, M M V, Storås, P, Schjølberg-Henriksen, K, Hasting, H K, Jakobsen, H

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Decision Support for Subjects Exposed to Heat Stress von Seeberg, T. M., Vardøy, A. B., Taklo, M. M. V., Austad, H. O.

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Design, process and characterisation of a high-performance vibration sensor for wireless condition monitoring von Vogl, Andreas, Wang, Dag T., Storås, Preben, Bakke, Thor, Taklo, Maaike M.V., Thomson, Allan, Balgård, Lennart

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Interconnects and substrates for thermal considerations von Larsson, A., Vardoy, A. B., Oldervoll, F., Storstrom, O., Mielnik, M., Dalton, E., Mahmood, K., Deokki Min, Taklo, M. M. V.

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Impact of SiO sub(2) on Al-Al thermocompression wafer bonding von Malik, Nishant, Schjolberg-Henriksen, Kari, Poppe, Erik U, Taklo, Maaike M V, Finstad, Terje G

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Impact of SiO 2 on Al–Al thermocompression wafer bonding von Malik, Nishant, Schjølberg-Henriksen, Kari, Poppe, Erik U, Taklo, Maaike M V, Finstad, Terje G

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Hermeticity and Reliability of Al-Al Thermocompression Wafer Bonding von Malik, Nisant, Poppe, Erik, Schjolberg-Henriksen, Kari, Taklo, Maaike Margrete Visser, Finstad, Terje G

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Environmental Stress Testing of Wafer-Level Al-Al Thermocompression Bonds: Strength and Hermeticity von Malik, N., Poppe, E., Schjølberg-Henriksen, K., Taklo, M. M. V., Finstad, T. G.

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Anodic bonding of glass to aluminium von SCHJØLBERG-HENRIKSEN, K, POPPE, E, MOE, S, STORAS, P, TAKLO, M. M. V, WANG, D. T, JAKOBSEN, H

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(Invited) 3D Interconnect Technologies for Advanced MEMS/NEMS Applications von Lietaer, Nicolas, Taklo, Maaike, Schjo̸lberg-Henriksen, Kari, Ramm, P.

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Void Formation and Bond Strength Investigated for Wafer-Level Cu-Sn Solid-Liquid Interdiffusion (SLID) Bonding von Vardøy, Astrid-Sofie B., van de Wiel, H. J., Martinsen, Stian, Hayes, Greg R., Fischer, Hartmut R., Aasmundtveit, Knut E., Lapadatu, Adriana, Taklo, Maaike M. V.

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Compliant interconnects for reduced cost of a ceramic ball grid array carrier von Taklo, M. M. V., Larsson, A., Vardoy, A. B., Kristiansen, H., Hoff, L., Waaler, K.

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Characterization of hermetic wafer-level Cu-Sn SLID bonding von van de Wiel, H. J., Vardoy, A-S. B., Hayes, G., Fischer, H. R., Lapadatu, A., Taklo, M. M. V.

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Failure analysis of thermally and mechanically stressed plastic core solder balls von Taklo, M. M. V., Graff, J. Seland, Wright, D. Nilsen, Kristiansen, H., Hoff, L., Waaler, K.

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Void formation and bond strength investigated for wafer-level Cu-Sn solid-liquid interdiffusion (SLID) bonding von Vardøy, Astrid-Sofie B., van de Wiel, H.J., Martinsen, Stian, Hayes, Greg R., Fischer, Hartmut R., Aasmundtveit, Knut E., Lapadatu, Adriana, Taklo, Maaike M. V.

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3D Integration of MEMS and IC: Design, Technology and Simulations: Advanced Processes and Materials von Taklo, Maaike M. V., SchjøLberg-Henriksen, Kari, Lietaer, Nicolas, Prainsack, Josef, Elfving, Anders, Weber, Josef, Klein, Matthias, Schneider, Peter, Reitz, Sven

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