High-efficiency planarization method combining mechanical polishing and atmospheric-pressure plasma etching for hard-to-machine semiconductor substrates von SANO, Yasuhisa, SHIOZAWA, Kousuke, DOI, Toshiro, KUROKAWA, Syuhei, AIDA, Hideo, MIYASHITA, Tadakazu, YAMAUCHI, Kazuto

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難加工次世代単結晶のための次世代型CMP加工技術: プラズマ/CMP同時融合加工の実用化に向けて von 會田, 英雄, 武田, 秀俊, 宮下, 忠一, 鍛治倉, 惇, 土肥, 俊郎

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Proposal of Magnetic-Force-Assisted Polishing Method von Wada, Tatsuyuki, Uneda, Michio, Yamamoto, Yuko, Miyashita, Tadakazu, Ishikawa, Ken-ichi

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Real-Time Prediction of Removal Rate and Friction Coefficient During Chemical Mechanical Polishing Using Motor Load Currents with a Polisher von Uneda, Michio, Ota, Shunpei, Takiguchi, Shunsuke, Yamamoto, Yuko, Miyashita, Tadakazu, Ishikawa, Ken-ichi

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Building of super high-efficiency processing technology based on innovative concept (Establishment of effective polishing process of SiC substrate using Dilatancy pad tool with bow... von DOI, Toshiro K., SESHIMO, Kiyoshi, YAMAZAKI, Tsutomu, OHTSUBO, Masanori, NISHIZAWA, Hideaki, MURAKAMI, Sachi, ICHIKAWA, Daizo, NAKAMURA, Yoshio, MIYASHITA, Tadakazu, KAWAMURA, Yoshihide, TAKAGI, Masataka, KASHIWADA, Hiroshi, AIDA, Hideo

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Relationships among Carrier, Friction Coefficient and Removal Rate of Double-Sided Polishing: Effect of Carrier on Friction Coefficient between Polishing Pad and Substrate and Corr... von UNEDA, Michio, HIYAMA, Michiaki, IZUMIDA, Ryo, SHIBUYA, Kazutaka, MIYASHITA, Tadakazu, ISHIKAWA, Ken-ichi

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Hybrid Effect Study of Pad-Conditioning/Slurry-Supply by High-Pressure-Micro-Jet (HPMJ) Method during CMP Process von Wang, Chengwu, Doi, Toshiro, Miyachi, Keiji, Tsukamoto, Keiichi, Miyashita, Tadakazu, Kurokawa, Syuhei, Fan, Li, Zhang, Yu, Hang, Wei

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Next Generation CMP Process Technique for Hard-to-Process Single Crystals von AIDA, Hideo, TAKEDA, Hidetoshi, MIYASHITA, Tadakazu, KAJIKURA, Atsushi, DOI, Toshiro

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Smart Polishing of Hard-to-Machine Materials with an Innovative Dilatancy Pad under High-Pressure, High-Speed, Immersed Condition von Doi, Toshiro K., Seshimo, Kiyoshi, Yamazaki, Tsutomu, Ohtsubo, Masanori, Ichikawa, Daizo, Miyashita, Tadakazu, Takagi, Masataka, Saeki, Taku, Aida, Hideo

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Proposal of Intelligent Polishing System by Artificial Intelligence Using Neural Networks von YOSHISAKI, Daichi, UNEDA, Michio, SHIBUYA, Kazutaka, MIYASHITA, Tadakazu, ISHKAWA, Ken-ichi

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ニューラルネットワークを用いたAIによる知能研磨システムの提案 von 吉崎, 大地, 畝田, 道雄, 澁谷, 和孝, 宮下, 忠一, 石川, 憲一

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両面同時研磨におけるキャリアと摩擦係数並びに研磨レートの関係: キャリアが上下研磨パッドと基板相互間の摩擦係数に及ぼす影響および摩擦係数と研磨レートの相関... von 畝田, 道雄, 檜山, 道明, 泉田, 涼, 澁谷, 和孝, 宮下, 忠一, 石川, 憲一

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WORK PROCESSING APPARATUS von AIDA, Hideo, KAJIKURA, Atsushi, DOI, Toshiro, TAKEDA, Hidetoshi, MIYASHITA, Tadakazu

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Double-side polishing apparatus von MIYASHITA TADAKAZU, KOYAMA SHOGO

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WORKPIECE CENTERING APPARATUS AND METHOD OF CENTERING WORKPIECE von TADAKAZU MIYASHITA, YOSUKE KANAI

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DOUBLE-SIDE POLISHING APPARATUS von MIYASHITA TADAKAZU, KOYAMA SHOGO

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Polishing apparatus von KISHIDA, HIROMI, MIYASHITA, TADAKAZU

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POLISHING APPARATUS von HIROMI KISHIDA, TADAKAZU MIYASHITA

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革新的概念に基づく超高効率加工技術の構築（ダイラタンシー・パッド工具と液中加工システムによるSiC基板の効果的加工プロセスの確立）... von 土肥, 俊郎, 瀬下, 清, 山崎, 努, 大坪, 正徳, 西澤, 秀明, 村上, 幸, 市川, 大造, 中村, 由夫, 宮下, 忠一, 川村, 佳秀, 高木, 正孝, 柏田, 太志, 曾田, 英雄

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Workpiece centering apparatus and method of centering workpiece von MIYASHITA TADAKAZU, KANAI YOSUKE

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