Structural Influence of Terminal Functional Groups on TEG-Based Leveler in Microvia Filling von Lee, Myung Hyun, Lee, Yoonjae, Sung, Minjae, Cho, Sung Ki, Kim, Young Gyu, Kim, Jae Jeong

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Bromide Ion as a Leveler for High-Speed TSV Filling von Sung, Minjae, Yoon, Young, Hong, Jinwoo, Kim, Myung Jun, Kim, Jae Jeong

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Superconformal Cobalt Electrodeposition with a Hydrogen Evolution Reaction Suppressing Additive von Kang, Jungkyu, Sung, Minjae, Byun, Jinuk, Kwon, Oh Joong, Kim, Jae Jeong

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Effects of Organic Additives on Grain Growth in Electrodeposited Cu Thin Film during Self-Annealing von Sung, Minjae, Kim, Hoe Chul, Lim, Taeho, Kim, Jae Jeong

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Proton Sensitive Additive for Cobalt Electrodeposition von Kang, Jungkyu, Sung, Minjae, Byun, Jinuk, Kwon, Oh Joong, Kim, Jae Jeong

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Polyethylene Glycol-Based Single Organic Additive for Through Silicon Via Filling and its Structural Modification Effect von Sung, Minjae, Lee, Yoonjae, Lee, Myunghyun, Jeon, Youngkeun, Lim, Taeho, Kim, Young Gyu, Kim, Jae Jeong

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Observation of Bis-(3-sulfopropyl) Disulfide (SPS) Breakdown at the Cu Cathode and Insoluble Anode under Open-Circuit, Unpowered Closed-Circuit, and Electrolysis Conditions von Kim, Tae Young, Sung, Minjae, Yoon, Young, Lee, Kyu Hwan, Choe, Seunghoe, Kim, Jae Jeong

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Thermodynamic aspects of bis(3‑sulfopropyl) disulfide and 3‑mercapto‑1‑propanesulfonic acid in Cu electrodeposition von Shen, Huizi, Kim, Hoe Chul, Sung, Minjae, Lim, Taeho, Kim, Jae Jeong

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Working mechanism of iodide ions and its application to Cu microstructure control in through silicon via filling von Sung, MinJae, Kim, Sang-Hyeok, Lee, Hyo-Jong, Lim, Taeho, Kim, Jae Jeong

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Sulfur-Containing Additives for Mitigating Cu Protrusion in Through Silicon via (TSV) von Sung, Minjae, Lee, Anna, Kim, Taeyoung, Yoon, Young, Lim, Taeho, Kim, Jae Jeong

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LIGHT EMITTING ELEMENT, POLYCYCLIC COMPOUND FOR THE SAME, AND DISPLAY DEVICE INCLUDING THE SAME von SIM, Mun-Ki, PAK, Sun Young, JUNG, Minjung, OH, Chanseok, SUNG, MinJae, HUR, Seonhyoung

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LIGHT EMITTING ELEMENT AND FUSED POLYCYCLIC COMPOUND FOR THE LIGHT EMITTING ELEMENT von KIM, Taeil, SIM, Mun-ki, PAK, Sun Young, JUNG, Minjung, SUNG, MinJae, HUR, Seonhyoung

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LIGHT-EMITTING DEVICE INCLUDING CONDENSED CYCLIC COMPOUND, ELECTRONIC APPARATUS INCLUDING THE LIGHT-EMITTING DEVICE, AND THE CONDENSED CYCLIC COMPOUND von Sung, Minjae, Hur, Seonhyoung, Park, Junha, Kim, Taeil, Oh, Chanseok, Jung, Minjung

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LIGHT EMITTING ELEMENT AND FUSED POLYCYCLIC COMPOUND FOR THE LIGHT EMITTING ELEMENT von SIM, MUN-KI, PARK, JUNHA, JUNG, MINJUNG, SUNG, MinJae, HUR, Seonhyoung, KIM, TAEIL

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LIGHT-EMITTING DEVICE INCLUDING HETEROCYCLIC COMPOUND, ELECTRONIC APPARATUS INCLUDING THE LIGHT-EMITTING DEVICE, AND THE HETEROCYCLIC COMPOUND von Sim, Munki, Sung, Minjae, Sunwoo, Kyoung, Pak, Sunyoung, Park, Junha, Oh, Chanseok

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LIGHT EMITTING DEVICE AND FUSED POLYCYCLIC COMPOUND FOR THE LIGHT EMITTING DEVICE von PARK, JUNHA, SUNWOO, Kyoung, PAK, SUN YOUNG, JUNG, MINJUNG, SUNG, MinJae, KIM, TAEIL, BAEK, JANG YEOL

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LIGHT EMITTING ELEMENT AND FUSED POLYCYCLIC COMPOUND FOR THE SAME von SIM, MUN-KI, PARK, JUNHA, JUNG, MINJUNG, SUNG, MinJae, KIM, TAEIL

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CONDENSED CYCLIC COMPOUND, LIGHT-EMITTING DEVICE INCLUDING THE CONDENSED CYCLIC COMPOUND, AND ELECTRONIC APPARATUS INCLUDING THE LIGHT-EMITTING DEVICE von Sung, Minjae, Sunwoo, Kyoung, Hur, Seonhyoung, Baek, Jangyeol, Kim, Taeil, Jung, Minjung

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LIGHT EMITTING DEVICE AND FUSED POLYCYCLIC COMPOUND FOR THE LIGHT EMITTING DEVICE von PARK, JUNHA, JUNG, MINJUNG, SUNG, MinJae, HUR, Seonhyoung, KIM, TAEIL, BAEK, JANG YEOL

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LIGHT EMITTING ELEMENT AND FUSED POLYCYCLIC COMPOUND FOR THE SAME von SUNG, MINJAE, JUNG, MINJUNG, HUR, SEONHYOUNG, OH, CHANSEOK, KIM, TAEIL, BAEK, JANG YEOL

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