A review of mechanical properties of lead-free solders for electronic packaging von Ma, Hongtao, Suhling, Jeffrey C.

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Experimental determination of fatigue behavior of lead free solder joints in microelectronic packaging subjected to isothermal aging von Mustafa, Muhannad, Suhling, Jeffrey C., Lall, Pradeep

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Impact of Mechanical Property Degradation and Intermetallic Compound Formation on Electromigration-Oriented Failure of a Flip-Chip Solder Joint von Ahmed, Md. Tusher, Motalab, Mohammad, Suhling, Jeffrey C.

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First-Order Piezoresistive Coefficients of Lateral NMOS FETs on 4H Silicon Carbide von Jaeger, Richard C., Chen, Jun, Suhling, Jeffrey C., Fursin, Leonid

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First- and Second-Order Piezoresistive Coefficients of CMOS FETs From Strong Into Weak Inversion von Jaeger, Richard C., Suhling, Jeffrey C.

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Effects of high temperature aging on the microstructural evolution and mechanical behavior of SAC305 solder joints using synchrotron X-ray microdiffraction and nanoindentation von Hasnine, Md, Suhling, Jeffrey C., Bozack, Michael J.

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Packaging Reliability Effect of ENIG and ENEPIG Surface Finishes in Board Level Thermal Test under Long-Term Aging and Cycling von Shen, Chaobo, Hai, Zhou, Zhao, Cong, Zhang, Jiawei, Evans, John L, Bozack, Michael J, Suhling, Jeffrey C

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Diagonal Mode van der Pauw Stress Sensors: Proof of Diagonal-Mode Conjecture von Jaeger, Richard C, Suhling, Jeffrey C, Chen, Jun

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CMOS Sensor Arrays for High Resolution Die Stress Mapping in Packaged Integrated Circuits von Yonggang Chen, Jaeger, R. C., Suhling, J. C.

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Silicon piezoresistive stress sensors and their application in electronic packaging von Suhling, J.C., Jaeger, R.C.

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Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors” [ASME J. Electron. Packag., 2014, 136(4), p. 041014; DOI: 10.1115/1.4028333] von Jaeger, Richard C, Motalab, Mohammad, Hussain, Safina, Suhling, Jeffrey C

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Characterization of the Temperature Dependence of the Piezoresistive Coefficients of Silicon From 150\,^C to 125\,^C von Chun-Hyung Cho, Jaeger, R.C., Suhling, J.C.

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Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors von Jaeger, Richard C, Motalab, Mohammad, Hussain, Safina, Suhling, Jeffrey C

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Sound Attenuation Study of Micro-Scale Acoustic Package von Zhang, Fuxi, Flowers, George T., Dean, Robert N., Suhling, Jeffrey C., Roberts, Jordan C.

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CMOS stress sensors on [100] silicon von Jaeger, R.C., Suhling, J.C., Ramani, R., Bradley, A.T., Jianping Xu

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A 1D numerical model for rapid stress analysis in bipolar junction transistors von Gnanachchelvi, Parameshwaran, Wilamowski, Bogdan M., Jaeger, Richard C., Hussain, Safina, Suhling, Jeffrey C., Hamilton, Michael C.

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Combined Controller for Test System of High Capacity Hydraulic Pump von Meng, Wenjun, Suhling, Jeffrey C

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Characterization of Compressive Die Stresses in CBGA Microprocessor Packaging Due to Component Assembly and Heat Sink Clamping von Roberts, Jordan C, Motalab, Mohammad, Hussain, Safina, Suhling, Jeffrey C, Jaeger, Richard C, Lall, Pradeep

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First-Order Piezoresistive Coefficients of Lateral NMOS FETs on 4H Silicon Carbide (vol 19, pg 6037, 2019) von Jaeger, Richard C., Chen, Jun, Suhling, Jeffrey C., Fursin, Leonid

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Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation von Lall, Pradeep, Kasturi, Madhu, Wu, Haotian, Suhling, Jeff, Davis, Edward

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