Whisker growth behaviors in POSS-silanol modified Sn3.0Ag0.5Cu composite solders von Ma, Limin, Zuo, Yong, Liu, Sihan, Guo, Fu, Lee, Andre, Subramanian, K.N.

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Clinical decision analysis in the management of displaced mid-shaft clavicle fractures: the patient's perspective von Kalra, Sukhman, Sprot, Harry, Mukhopadhyay, Sudiptamohan, Subramanian, K.N, Robertson, Angus

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Evaluation of creep behavior of near-eutectic Sn–Ag solders containing small amount of alloy additions von Guo, F., Choi, S., Subramanian, K.N., Bieler, T.R., Lucas, J.P., Achari, A., Paruchuri, M.

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Electrochemical studies of Pd-doped Cu and Pd-doped Cu-Al intermetallics for understanding corrosion behavior in wire-bonding packages von Wu, Yuelin, Subramanian, K.N., Barton, Scott Calabrese, Lee, Andre

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Strain patterns in three different femoral interlocking nail-bone units: A biomechanical comparative study von Maripuri, S.N, Subramanian, K.N, Debnath, U.K, Evans, S, Mohanty, K

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Current concepts on management of cuff tear von Prabhakar, Akil, Kanthalu Subramanian, Jeash Narayan, Swathikaa, P., Kumareswaran, S.I., Subramanian, K.N.

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Microstructural characterisation of reflowed and isothermally-aged Cu and Ag particulate reinforced Sn-3.5Ag composite solders von Guo, F, Choi, S, Lucas, J.P, Subramanian, K.N

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Roles of imposed cyclic strain amplitude and cyclic strain rate on the stress relaxation behaviour of pre-strained eutectic Sn-3.5Ag solder joints von Rhee, H, Subramanian, K.N

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The Coraco-Gleno-Scapular Line: A Simple Novel Tool for Assessing Glenoid Bone Defects von Subramanian, K N, Saseendar, Jeash Narayan, K S, Krishna, Kumar M J, Easwar, B, Kumar, Dheepan, Iyyapan, G, Ravichandran, Aravind

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Mechanical characterization of Sn-3.5Ag solder joints at various temperatures von Rhee, H, Subramanian, K.N, Lee, A, Lee, J.G

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Intermetallic morphology around Ni particles in Sn-3.5Ag solder von Lee, J.G, Guo, F, Subramanian, K.N, Lucas, J.P

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Effect of strain on whisker growth in matte tin von Southworth, A.R, Ho, C.E, Lee, A, Subramanian, K.N

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Microstructural features contributing to enhanced behaviour of Sn-Ag based solder joints von Lee, J.G, Subramanian, K.N

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Creep behaviour of composite lead-free electronic solder joints von Guo, F, Lee, J, Subramanian, K.N

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Effects of Pb contamination on the eutectic Sn-Ag solder joint von Choi, S, Bieler, T.R, Subramanian, K.N, Lucas, J.P

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Effects of TMF heating rates on damage accumulation and resultant mechanical behavior of Sn–Ag based solder joints von Lee, J.G., Subramanian, K.N.

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Effects of internal stresses on the thermomechanical behavior of Sn-based solder joints von Subramanian, K.N., Lee, J.G.

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Electromigration induced microstructure and morphological changes in eutectic SnPb solder joints von Lee, A., Ho, C.E., Subramanian, K.N.

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Electrical conductivity changes in bulk Sn, and eutectic Sn-Ag in bulk and in joints, from aging and thermal shock von Guo, F., Lee, J.G., Hogan, T., Subramanian, K.N.

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Effect of cold rolling on the tensile properties of (Al 2O 3) p/Al composites von Lee, J.C., Subramanian, K.N.

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