Improved Dixon Resultant for Generating Signed Algebraic Level Sets and Algebraic Boolean Operations on Closed Parametric Surfaces von Vaitheeswaran, P., Subbarayan, G.

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A phase field computational procedure for electromigration with specified contact angle and diffusional anisotropy von Sadasiva, S., Vaitheeswaran, P., Subbarayan, G.

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Signed algebraic level sets on NURBS surfaces and implicit Boolean compositions for isogeometric CAD–CAE integration von Upreti, K., Subbarayan, G.

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Microstructural coarsening in Sn-Ag-based solders and its effects on mechanical properties von Dutta, I., Kumar, P., Subbarayan, G.

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Stereological Analysis of Microstructural Evolution Due to Aging in SnAgCu Solder Alloys von Chavali, S., Ganti, S. S., Liao, H., Subbarayan, G., Dutta, I., Dayananda, M.

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Isogeometric enriched field approximations von Tambat, A., Subbarayan, G.

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Simulations of arbitrary crack path deflection at a material interface in layered structures von Tambat, A., Subbarayan, G.

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Interface balance laws, phase growth and nucleation conditions for multiphase solids with inhomogeneous surface stress von Vaitheeswaran, P., Udupa, A., Sadasiva, S., Subbarayan, G.

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Algebraic distance estimations for enriched isogeometric analysis von Upreti, K., Song, T., Tambat, A., Subbarayan, G.

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A sharp interface isogeometric solution to the Stefan problem von Song, T., Upreti, K., Subbarayan, G.

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Constitutive and Aging Behavior of Sn3.0Ag0.5Cu Solder Alloy von Mysore, K., Subbarayan, G., Gupta, V., Ron Zhang

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Maximum-Entropy Principle for Modeling Damage and Fracture in Solder Joints von Chan, D, Subbarayan, G, Nguyen, L

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Maximum-Entropy Principle for Modeling Damage and Fracture in Solder Joints: Enabling Life Predictions under Microstructural Uncertainty von Chan, D., Subbarayan, G., Nguyen, L.

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A hybrid model for computationally efficient fatigue fracture simulations at microelectronic assembly interfaces von Towashiraporn, P., Subbarayan, G., Desai, C.S.

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Wrinkling on irreversibly deforming foundations von Srinivasan, K., Subbarayan, G., Siegmund, T.

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HiGeoM: A symbolic framework for a unified function space representation of trivariate solids for isogeometric analysis von Morgan, O.T., Upreti, K., Subbarayan, G., Anderson, D.C.

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A non-contact, thermally-driven buckling delamination test to measure interfacial fracture toughness of thin film systems von Goyal, S., Srinivasan, K., Subbarayan, G., Siegmund, T.

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CAD inspired hierarchical partition of unity constructions for NURBS-based, meshless design, analysis and optimization von Rayasam, M., Srinivasan, V., Subbarayan, G.

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Maximum entropy fracture model and its use for predicting cyclic hysteresis in Sn3.8Ag0.7Cu and Sn3.0Ag0.5 solder alloys von Tucker, J.P., Chan, D.K., Subbarayan, G., Handwerker, C.A.

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A meshless, compositional approach to shape optimal design von Zhang, X., Rayasam, M., Subbarayan, G.

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