A 2.5D Integrated Voltage Regulator Using Coupled-Magnetic-Core Inductors on Silicon Interposer von Sturcken, N., O'Sullivan, E. J., Wang, N., Herget, P., Webb, B. C., Romankiw, L. T., Petracca, M., Davies, R., Fontana, R. E., Decad, G. M., Kymissis, I., Peterchev, A. V., Carloni, L. P., Gallagher, W. J., Shepard, K. L.

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Integrated Transformers With Magnetic Thin Films von Hao Wu, Lekas, Michael, Davies, Ryan, Shepard, Kenneth L., Sturcken, Noah

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Magnetic Thin-Film Inductors With Induced Radial Anisotropy for Improved Inductance Density von Lekas, Michael S., Davies, Ryan, Sturcken, Noah

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A Switched-Inductor Integrated Voltage Regulator With Nonlinear Feedback and Network-on-Chip Load in 45 nm SOI von Sturcken, N., Petracca, M., Warren, S., Mantovani, P., Carloni, L. P., Peterchev, A. V., Shepard, K. L.

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Optimization of ultra-soft CoZrTa/SiO2/CoZrTa trilayer elements for integrated inductor structures von Cheng, Cheng, Davies, Ryan, Sturcken, Noah, Shepard, Kenneth, Bailey, William E.

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Coupled Inductors With Crossed Anisotropy CoZrTa/SiO2 Multilayer Cores von DAVIES, Ryan P, CHENG CHENG, STURCKEN, Noah, BAILEY, William E, SHEPARD, Kenneth L

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Integrated on-chip inductors with electroplated magnetic yokes (invited) von Wang, Naigang, O'Sullivan, Eugene J., Herget, Philipp, Rajendran, Bipin, Krupp, Leslie E., Romankiw, Lubomyr T., Webb, Bucknell C., Fontana, Robert, Duch, Elizabeth A., Joseph, Eric A., Brown, Stephen L., Hu, Xiaolin, Decad, Gary M., Sturcken, Noah, Shepard, Kenneth L., Gallagher, William J.

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Vector control of induced magnetic anisotropy using an in situ quadrupole electromagnet in ultrahigh vacuum sputtering von Cheng, Cheng, Sturcken, Noah, Shepard, Kenneth, Bailey, William E.

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Coupled Inductors With Crossed Anisotropy Multilayer Cores von Davies, Ryan P., Cheng, Cheng, Sturcken, Noah, Bailey, William E., Shepard, KennethL

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MULTI-LAYERED METAL FRAME POWER PACKAGE von LEKAS, Michael, STURCKEN, Noah

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MULTI-LAYERED METAL FRAME POWER PACKAGE von LEKAS, Michael, STURCKEN, Noah

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MULTI-LAYERED METAL FRAME POWER PACKAGE von LEKAS, Michael, STURCKEN, Noah

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Multi-Layered Metal Frame Power Package von Sturcken, Noah, Lekas, Michael

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Design of coupled power inductors with crossed anisotropy magnetic core for integrated power conversion von Sturcken, N., Davies, R., Cheng Cheng, Bailey, W. E., Shepard, K. L.

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Integrated circuit with laminated magnetic core inductor and magnetic flux closure layer von Davies, Ryan, Sturcken, Noah, Lekas, Michael

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Compact transceiver on a multi-level integrated circuit von Sturcken, Noah, Lekas, Michael

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Method of manufacturing laminated magnetic core inductor with insulating and interface layers von Davies, Ryan, Sturcken, Noah, Lekas, Michael

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(Invited) Developments in Integrated On-Chip Inductors with Magnetic Yokes von O'Sullivan, Eugene J, Wang, Naigang, Herget, Philipp, Romankiw, Lubomyr T., Webb, Bucknell C., Fontana, Robert E., Sturcken, Noah, Shepard, Kenneth L., Gallagher, William J.

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Package Voltage Regulators: The Answer for Power Management Challenges von Meyer, Joseph, Moghimi, Reza, Sturcken, Noah

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LAMINATED MAGNETIC CORE INDUCTOR WITH INSULATING AND INTERFACE LAYERS von LEKAS, Michael, STURCKEN, Noah, DAVIES, Ryan

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