Aligned deposition of bottom-up grown nanowires by two-directional pressure-controlled contact printing von Salimitari, P, Behroudj, A, Strehle, S

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Exploring nanowire regrowth for the integration of bottom-up grown silicon nanowires into AFM scanning probes von Behroudj, A, Salimitari, P, Nilsen, M, Strehle, S

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Surface-controlled contact printing for nanowire device fabrication on a large scale von Roßkopf, D, Strehle, S

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Thermal oxidation synthesis of crystalline iron-oxide nanowires on low-cost steel substrates for solar water splitting von Dlugosch, T, Chnani, A, Muralidhar, P, Schirmer, A, Biskupek, J, Strehle, S

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The mechanisms of platinum-catalyzed silicon nanowire growth von Hibst, N, Knittel, P, Biskupek, J, Kranz, C, Mizaikoff, B, Strehle, S

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Beam-deposited platinum as versatile catalyst for bottom-up silicon nanowire synthesis von Hibst, N., Knittel, P., Kranz, C., Mizaikoff, B., Strehle, S.

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Electrical properties of electroplated Cu(Ag) thin films von Strehle, S., Bartha, J.W., Wetzig, K.

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A study of imprint and etching behavior on fused silica of a new tailored resist mr-NIL213FC for soft UV-NIL von Si, Shuhao, Weigel, C., Messerschmidt, M., Thesen, M.W., Sinzinger, S., Strehle, S.

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Electroplating of Cu(Ag) thin films for interconnect applications von Strehle, S., Menzel, S., Bartha, J.W., Wetzig, K.

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Microstructure of electroplated Cu(Ag) alloy thin films von Strehle, S., Menzel, S., Wetzig, K., Bartha, J.W.

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Electrical Evaluation of Ru–W(-N), Ru–Ta(-N) and Ru–Mn films as Cu diffusion barriers von Wojcik, H., Kaltofen, R., Merkel, U., Krien, C., Strehle, S., Gluch, J., Knaut, M., Wenzel, C., Preusse, A., Bartha, J.W., Geidel, M., Adolphi, B., Neumann, V., Liske, R., Munnik, F.

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Electromigration in electroplated Cu(Ag) alloy thin films investigated by means of single damascene Blech structures von Strehle, S., Menzel, S., Jahn, A., Merkel, U., Bartha, J.W., Wetzig, K.

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Top injection reactor tool with in situ spectroscopic ellipsometry for growth and characterization of ALD thin films von Schmidt, D., Strehle, S., Albert, M., Hentsch, W., Bartha, J.W.

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Effect of Ag-alloying addition on the stress–temperature behavior of electroplated copper thin films von Menzel, S., Strehle, S., Wendrock, H., Wetzig, K.

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Investigation of organic impurities adsorbed on and incorporated into electroplated copper layers von Stangl, M., Dittel, V., Acker, J., Hoffmann, V., Gruner, W., Strehle, S., Wetzig, K.

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Modeling of residual stresses in thin films deposited by electron beam evaporation von Guisbiers, G., Strehle, S., Wautelet, M.

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Effect of wet chemical substrate pretreatment on the growth behavior of Ta(N) films deposited by thermal ALD von Strehle, S., Schumacher, H., Schmidt, D., Knaut, M., Albert, M., Bartha, J.W.

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Microactuators, Microsensors and Micromechanisms: Mamm 2020 von Zentner, Lena, Strehle, Steffen

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Microstructural investigation of electrodeposited CuAg-thin films von Strehle, S., Menzel, S., Wendrock, H., Acker, J., Wetzig, K.

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Thermo-mechanical behavior and microstructural evolution of electrochemically deposited low-alloyed Cu(Ag) thin films von Strehle, S., Menzel, S., Wendrock, H., Acker, J., Gemming, T., Wetzig, K.

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