Interconnecting to aluminum- and copper-based semiconductors (electroless-nickel/gold for solder bumping and wire bonding) von Strandjord, Andrew J.G, Popelar, Scott, Jauernig, Christine

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On the Mechanical Reliability of Photo-BCB-Based Thin Film Dielectric Polymer for Electronic Packaging Applications von Im, Jang-hi, Shaffer, Edward O, Stokich, Theodore, Strandjord, Andrew, Hetzner, Jack, Curphy, James, Karas, Cheryl, Meyers, Greg, Hawn, David, Chakrabarti, Ashok, Froelicher, Steve

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The proton-transfer kinetics of 3-hydroxyflavone: solvent effects von Strandjord, Andrew J. G, Barbara, P. F

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Structural effects on the proton-transfer kinetics of 3-hydroxyflavones von Strandjord, Andrew J. G, Smith, David E, Barbara, Paul F

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Wafer Level Packaging of Compound Semiconductors von Strandjord, Andrew, Teutsch, Thorsten, Scheffler, Axel, Otto, Bernd, Paat, Anna, Alinabon, Oscar, Li, Jing

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Wafer Level Packaging of Compound Semiconductors: Revised and selected papers from the IMAPS 6th Annual International Conference on Device Packaging, Fountain Hills, Arizona, March... von STRANDJORD, Andrew, TEUTSCH, Thorsten, SCHEFFLER, Axel, OTTO, Bernd, PAAT, Anna, ALINABON, Oscar, JING LI

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Electroless Nickel/Gold Under-Bump-Metallization Cost Comparisons von Strandjord, Andrew J., Scheffler, Axel, Zakel, Elke, Oppert, Thomas, Teutsch, Thorsten

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WLCSP and Flip Chip bumping technologies von Strandjord, Andrew, Teutsch, Thorsten, Scheffler, Axel, Oppert, Thomas, Azdasht, Ghassem, Zakel, Elke

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Picosecond time-resolved emission spectra: techniques and examples von Brearley, Ann M., Strandjord, Andrew J.G., Flom, Steven R., Barbara, Paul F.

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ADHESION PROMOTER AND SELF-PRIMING RESIN COMPOSITIONS AND ARTICLES MADE THEREFROM von HETZNER, JACK, E, TOWNSEND, PAUL, H., III, STRANDJORD, ANDREW, J, MARTIN,BRIAN,B, SCHMIDT, DONALD, L, HARRIS, ROBERT, F, STOKICH, THEODORE, M., JR, FRYE, DONALD, C

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Optical recording media containing uniform partially oxidized metal layer von WEBB, STEVEN P, STRANDJORD, ANDREW J. G

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Method for the preparation of optical recording media containing uniform partially oxidized metal layer von WEBB, STEVEN P, STRANDJORD, ANDREW J. G

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OPTICAL RECORDING MEDIA CONTAINING UNIFORM PARTIALLY OXIDIZED METAL LAYER AND METHOD FOR THEIR PREPARATION von WEBB, STEVEN, P, STRANDJORD, ANDREW, J., G

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MCM-LD: large area processing using photosensitive-BCB von Strandjord, A.J.G., Garrou, P.E., Heistand, R.H., Tessier, T.G.

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Adhesion promoter and self-priming resin compositions and articles made therefrom von HETZNER, JACK E, HARRIS, ROBERT F, MARTIN, BRIAN B, STRANDJORD, ANDREW J, STOKICH, THEODORE M. JR

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The Electrochemical Effects of Immersion Au on Electroless Nickel and Its Consequences on the Hermetic Reliability of a Semiconductor Device von Herbsommer, J., Teutsch, T., Strandjord, A.

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MEDIUM FÜR OPTISCHE AUFZEICHNUNG von STRANDJORD, ANDREW, J, YATES, RONALD, L, PERETTIE, DONALD, J

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OPTICAL RECORDING MEDIUM von STRANDJORD, ANDREW, J, YATES, RONALD, L, PERETTIE, DONALD, J

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Optical recording media containing overcoat von WOODARD, FLOYD E, WEBB, STEVEN P, STRANDJORD, ANDREW J. G

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Method for the preparation of optical recording media containing overcoat von WOODARD, FLOYD E, WEBB, STEVEN P, STRANDJORD, ANDREW J. G

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