Adhesive wafer bonding von Niklaus, F., Stemme, G., Lu, J. -Q., Gutmann, R. J.

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Side-opened out-of-plane microneedles for microfluidic transdermal liquid transfer von Griss, P., Stemme, G.

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A packaged optical slot-waveguide ring resonator sensor array for multiplex label-free assays in labs-on-chips von Carlborg, C F, Gylfason, K B, Kaźmierczak, A, Dortu, F, Bañuls Polo, M J, Maquieira Catala, A, Kresbach, G M, Sohlström, H, Moh, T, Vivien, L, Popplewell, J, Ronan, G, Barrios, C A, Stemme, G, van der Wijngaart, W

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Unconventional applications of wire bonding create opportunities for microsystem integration von Fischer, A C, Korvink, J G, Roxhed, N, Stemme, G, Wallrabe, U, Niklaus, F

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Penetration-Enhanced Ultrasharp Microneedles and Prediction on Skin Interaction for Efficient Transdermal Drug Delivery von Roxhed, N., Gasser, T.C., Griss, P., Holzapfel, G.A., Stemme, G.

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Zero-insertion-loss optical shutter based on electrowetting-on-dielectric actuation of opaque ionic liquid microdroplets von Ribet, F., De Luca, E., Ottonello-Briano, F., Swillo, M., Roxhed, N., Stemme, G.

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Binary-Coded 4.25-bit W-Band Monocrystalline-Silicon MEMS Multistage Dielectric-Block Phase Shifters von Somjit, N., Stemme, G., Oberhammer, J.

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Very high aspect ratio through-silicon vias (TSVs) fabricated using automated magnetic assembly of nickel wires von Fischer, A C, Bleiker, S J, Haraldsson, T, Roxhed, N, Stemme, G, Niklaus, F

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Active Opening Force and Passive Contact Force Electrostatic Switches for Soft Metal Contact Materials von Oberhammer, J., Stemme, G.

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Fabrication of an infrared emitter using a generic integration platform based on wire bonding von Schröder, S, Rödjegård, H, Fischer, A C, Stemme, G, Niklaus, F

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A comparative study of the bonding energy in adhesive wafer bonding von Forsberg, F, Saharil, F, Haraldsson, T, Roxhed, N, Stemme, G, van der Wijngaart, W, Niklaus, F

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Micromachined flat-walled valveless diffuser pumps von Olsson, A., Enoksson, P., Stemme, G., Stemme, E.

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Room-Temperature Sealing of Microcavities by Cold Metal Welding von Decharat, A., Junchun Yu, Boers, M., Stemme, G., Niklaus, F.

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Selective wafer-level adhesive bonding with benzocyclobutene for fabrication of cavities von Oberhammer, J., Niklaus, F., Stemme, G.

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Low-temperature full wafer adhesive bonding von Niklaus, Frank, Enoksson, Peter, Kälvesten, Edvard, Stemme, Göran

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Micromachined electrodes for biopotential measurements von Griss, P., Enoksson, P., Tolvanen-Laakso, H.K., Merilainen, P., Ollmar, S., Stemme, G.

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BCB contact printing for patterned adhesive full-wafer bonded 0-level packages von Oberhammer, J., Stemme, G.

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Mechanically tri-stable, true single-pole-double-throw (SPDT) switches von Oberhammer, J, Tang, M, Liu, A-Q, Stemme, G

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High-Yield Passive Plasma Filtration from Human Finger Prick Blood von Hauser, Janosch, Lenk, Gabriel, Hansson, Jonas, Beck, Olof, Stemme, Göran, Roxhed, Niclas

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Wafer-Scale Manufacturing of Bulk Shape-Memory-Alloy Microactuators Based on Adhesive Bonding of Titanium-Nickel Sheets to Structured Silicon Wafers von Braun, S., Sandstrom, N., Stemme, G., van der Wijngaart, W.

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