Protection of yttria-stabilized zirconia for dental applications by oxidic PVD coating von Hübsch, C., Dellinger, P., Maier, H.J., Stemme, F., Bruns, M., Stiesch, M., Borchers, L.

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Correlation of the microstructure and microwave properties of Ba0.6Sr0.4TiO3 thick-films von Zhou, X., Sazegar, M., Stemme, F., Haußelt, J., Jakoby, R., Binder, J.R.

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Fabrication and characterization of iron and fluorine co-doped BST thin films for microwave applications von Stemme, F., Bruns, M., Geßwein, H., Schroeder, M., Sazegar, M., Drahus, M. D., Eichel, R.-A., Paul, F., Azucena, C., Binder, J. R.

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Effects of thermal processing and iron doping in co-sputtered barium strontium titanate thin films von Stemme, F., Bruns, M., Geßwein, H., Schroeder, M., Sazegar, M., Drahus, M. D., Eichel, R.-A., Paul, F., Haußelt, J., Binder, J. R.

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Characterization of non-stoichiometric co-sputtered Ba.sub.0.6Sr.sub.0.4.sub.1 + xO.sub.3 - δ thin films for tunable passive microwave applications von Stemme, F, Geßwein, H, Drahus, M. D, Hollander, B, Azucena, C, Binder, J. R, Eichel, R.-A, Haußelt, J, Bruns, M

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Characterization of non-stoichiometric co-sputtered Ba0.6Sr0.4(Ti1-xFex)1+xO3- Delta d thin films for tunable passive microwave applications von Stemme, F, Gesswein, H, Drahus, M D, Hollander, B, Azucena, C, Binder, J R, Eichel, R-A, Hausselt, J, Bruns, M

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Characterization of non-stoichiometric co-sputtered Ba0.6Sr0.4(Ti1 − x Fe x )1 + x O3 − δ thin films for tunable passive microwave applications von Stemme, F., Geßwein, H., Drahus, M. D., Holländer, B., Azucena, C., Binder, J. R., Eichel, R.-A., Haußelt, J., Bruns, M.

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Characterization of non-stoichiometric co-sputtered Ba0.6Sr0.4(Ti1 − xFex)1 + xO3 − δ thin films for tunable passive microwave applications von Stemme, F., Geßwein, H., Drahus, M. D., Holländer, B., Azucena, C., Binder, J. R., Eichel, R.-A., Haußelt, J., Bruns, M.

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How to obtain public improvements in the city of St. Louis von Stemme, F[erdinand] L. [from old catalog]

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Strukturierung von Kathodenmaterialien für Lithium‐Ionen‐Batterien von Schön, M., Glatthaar, S., Geßwein, H., Schroeder, M., Stemme, F., Binder, J. R.

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Characterization of non-stoichiometric co-sputtered Ba0.6Sr0.4(Ti (1-x)Fe(x))(1+x)O(3-δ) thin films for tunable passive microwave applications von Stemme, F, Geßwein, H, Drahus, M D, Holländer, B, Azucena, C, Binder, J R, Eichel, R-A, Haußelt, J, Bruns, M

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Strukturierung von Kathodenmaterialien für Lithium-Ionen-Batterien von Schön, M., Glatthaar, S., Geßwein, H., Schroeder, M., Stemme, F., Binder, J. R.

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Adhesive wafer bonding von Niklaus, F., Stemme, G., Lu, J. -Q., Gutmann, R. J.

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3D Microvascularized Tissue Models by Laser‐Based Cavitation Molding of Collagen von Enrico, Alessandro, Voulgaris, Dimitrios, Östmans, Rebecca, Sundaravadivel, Naveen, Moutaux, Lucille, Cordier, Aurélie, Niklaus, Frank, Herland, Anna, Stemme, Göran

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Electromigrated Gold Nanogap Tunnel Junction Arrays: Fabrication and Electrical Behavior in Liquid and Gaseous Media von Raja, Shyamprasad N., Jain, Saumey, Kipen, Javier, Jaldén, Joakim, Stemme, Göran, Herland, Anna, Niklaus, Frank

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High-bandwidth low-current measurement system for automated and scalable probing of tunnel junctions in liquids von Raja, Shyamprasad N., Jain, Saumey, Kipen, Javier, Jaldén, Joakim, Stemme, Göran, Herland, Anna, Niklaus, Frank

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A packaged optical slot-waveguide ring resonator sensor array for multiplex label-free assays in labs-on-chips von Carlborg, C F, Gylfason, K B, Kaźmierczak, A, Dortu, F, Bañuls Polo, M J, Maquieira Catala, A, Kresbach, G M, Sohlström, H, Moh, T, Vivien, L, Popplewell, J, Ronan, G, Barrios, C A, Stemme, G, van der Wijngaart, W

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Bactericidal surfaces prepared by femtosecond laser patterning and layer-by-layer polyelectrolyte coating von Chen, Chao, Enrico, Alessandro, Pettersson, Torbjörn, Ek, Monica, Herland, Anna, Niklaus, Frank, Stemme, Göran, Wågberg, Lars

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Cleanroom‐Free Direct Laser Micropatterning of Polymers for Organic Electrochemical Transistors in Logic Circuits and Glucose Biosensors von Enrico, Alessandro, Buchmann, Sebastian, De Ferrari, Fabio, Lin, Yunfan, Wang, Yazhou, Yue, Wan, Mårtensson, Gustaf, Stemme, Göran, Hamedi, Mahiar Max, Niklaus, Frank, Herland, Anna, Zeglio, Erica

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Unconventional applications of wire bonding create opportunities for microsystem integration von Fischer, A C, Korvink, J G, Roxhed, N, Stemme, G, Wallrabe, U, Niklaus, F

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