Size-dependent resistivity of metallic wires in the mesoscopic range von Steinhögl, Werner, Schindler, Günther, Steinlesberger, Gernot, Engelhardt, Manfred

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Electrical assessment of copper damascene interconnects down to sub-50 nm feature sizes von Steinlesberger, G., Engelhardt, M., Schindler, G., Steinhögl, W., von Glasow, A., Mosig, K., Bertagnolli, E.

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Fabrication of Deep Sub-lithographic Al-Based Nanointerconnects Utilizing a Wet Chemical Hard Mask Trim Process von Engelhardt, Manfred, Steinlesberger, Gernot, Kirchner, Udo

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Reliability studies of narrow Cu lines von Schindler, Günther, Penka, Sabine, Steinlesberger, Gernot, Traving, Martin, Steinhögl, Werner, Engelhardt, Manfred

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Method for depositing a conductive carbon material on a semiconductor for forming a Schottky contact and semiconductor contact device von KREUPL FRANZ, STEINLESBERGER GERNOT

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Electrical circuit with a nanostructure and method for producing a contact connection of a nanostructure von SEIDEL ROBERT, KREUPL FRANZ, DUESBERG GEORG, STEINLESBERGER GERNOT

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Biosensor to indicate hybridisation and process to make biosensor with diamond coating with embedded trap molecules over electrodes von GRAHAM, ANDREW, STEINLESBERGER, GERNOT

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Production of a layer arrangement, used in the manufacture of integrated circuits e.g. transistors, comprises forming a first conducting layer, a structuring auxiliary layer and a... von GRAHAM, ANDREW, STEINLESBERGER, GERNOT

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Carbon layer formation, comprises precipitating a layer by introducing a carbon containing gas to a hydrogen atmosphere at high pressure and temperature von KREUPL, FRANZ, STEINLESBERGER, GERNOT

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Fabrication of Deep Sub-Lithographic Al-Based Nano Interconnects Utilizing a Wet Chemical Hard Mask Trim Process von Engelhardt, Manfred, Steinlesberger, Gernot, Kirchner, Udo

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ELECTRICAL CIRCUIT WITH A NANOSTRUCTURE AND METHOD FOR CONTACTING A NANOSTRUCTURE von DUESBERG, GEORG, SEIDEL, ROBERT, KREUPL, FRANZ, STEINLESBERGER, GERNOT

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Field Effect Transistor Arrangement von HARTWICH JESSICA, STEINLESBERGER GERNOT, DREESKORNFELD LARS

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ELECTRICAL CIRCUIT WITH A NANOSTRUCTURE AND METHOD FOR PRODUCING A CONTACT CONNECTION OF A NANOSTRUCTURE von SEIDEL ROBERT, KREUPL FRANZ, DUESBERG GEORG, STEINLESBERGER GERNOT

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Process for producing ultrathin homogenous metal layers von Steinlesberger, Gernot, Engelhardt, Manfred, Unger, Eugen

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Process for producing ultrathin homogenous metal layers von UNGER EUGEN, STEINLESBERGER GERNOT, ENGELHARDT MANFRED

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Process for depositing a catalyst von UNGER EUGEN, STEINLESBERGER GERNOT, ENGELHARDT MANFRED

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Selective and surface deposition of catalyst on strip conductor in integrated circuit comprises preparing acidic or alkaline aqueous solution of catalyst, applying on conductor, an... von ENGELHARDT, MANFRED, UNGER, EUGEN, STEINLESBERGER, GERNOT

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Process for producing ultrathin homogenous metal layers von UNGER EUGEN, STEINLESBERGER GERNOT, ENGELHARDT MANFRED

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Process for producing ultrathin homogenous metal layers von Steinlesberger, Gernot, Engelhardt, Manfred, Unger, Eugen

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Method for manufacturing a layer arrangement and layer arrangement von TRAVING MARTIN, UNGER EUGEN, STICH ANDREAS, SCHINDLER GUENTHER, STEINLESBERGER GERNOT, PAMLER WERNER, GABRIC ZVONIMIR

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