Solder joints on thick printed copper substrates von Hirman, Martin, Michal, David, Reboun, Jan, Steiner, Frantisek

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Industry 4.0 and business process management von Tupa, Jiri, Steiner, Frantisek

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Defect Trends in Fire Alarm Systems: A Basis for Risk-Based Inspection (RBI) Approaches von Veit, Stefan, Steiner, Frantisek

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Aspects of Risk Management Implementation for Industry 4.0 von Tupa, Jiri, Simota, Jan, Steiner, Frantisek

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Proposed Changes to the Inspection Strategy for Fire Alarm Systems: Empirical Analysis of Weak Points and Technical Influencing Factors von Veit, Stefan Siegfried, Steiner, František

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Optimization of solder paste quantity considering the properties of solder joints von Hirman, Martin, Steiner, Frantisek

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Design of a business readiness model to realise a green industry 4.0 company von Benešová, Andrea, Basl, Josef, Tupa, Jiří, Steiner, František

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Determination of Changes in Process Management within Industry 4.0 von Benešová, Andrea, Hirman, Martin, Steiner, František, Tupa, Jiří

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Alternative technology for SMD components connection by non-conductive adhesive on a flexible substrate von Hirman, Martin, Navratil, Jiri, Steiner, Frantisek, Dzugan, Tomas, Hamacek, Ales

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Study of low-temperature interconnection techniques for instant assembly of electronics on stretchable e-textile ribbons von Hirman, Martin, Navratil, Jiri, Steiner, Frantisek, Reboun, Jan, Soukup, Radek, Hamacek, Ales

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Shear Strength of Conductive Adhesive Joints on Rigid and Flexible Substrates Depending on Adhesive Quantity von Hirman, Martin, Steiner, Frantisek

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Design, Fabrication and Risk Assessment of IoT Unit for Products Manufactured in Industry 4.0 Factory von Hirman, Martin, Benesova, Andrea, Sima, Karel, Steiner, Frantisek, Tupa, Jiri

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Project Management during the Industry 4.0 Implementation with Risk Factor Analysis von Hirman, Martin, Benesova, Andrea, Steiner, Frantisek, Tupa, Jiri

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Fußball Unterm Gelben Stern: Die Liga Im Ghetto Theresienstadt 1943-44 von Zwicker, Stefan, Steiner, Frantisek

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RISK TREATING IN EARLY LIFECYCLE PHASES von Machac, Jan, Steiner, Frantisek

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Correlation analysis of wettability, intermetallic compound formation and PCB contamination von Steiner, Frantisek, Rendl, Karel, Wirth, Vaclav

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Reliability Testing of Recycled SMD Components Reused in E-Textiles after Ageing by Washing Cycles von Hirman, Martin, Navrátil, Jiri, Benesová, Andrea, Steiner, Frantisek

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USAGE OF DECISION SUPPORT SYSTEMS FOR DIAGNOSTIC PROCESS MANAGEMENT von Steiner, Frantisek, Hujer, Tomas, Tupa, Jiri

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Digital Transformation of Electrical Engineering Companies in the Czech Republic von Benešová, Andrea, Steiner, František, Tupa, Jiří

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SMD Components Recycling Procedure for Reuse in E-Textiles with Risk Analysis von Hirman, Martin, Benešová, Andrea, Navrátil, Jiří, Steiner, František, Tupa, Jiří

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