Mathematical modelling of moisture transport into an electronic enclosure under non-isothermal conditions von Staliulionis, Ž., Mohanty, S., Jabbari, M., Hattel, J.H.

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Moisture ingress into electronics enclosures under isothermal conditions von Staliulionis, Ž., Jabbari, M., Hattel, J. H.

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Modeling of Moisture Transport Into an Electronic Enclosure Using the Resistor-Capacitor Approach von Staliulionis, Ž, Conseil-Gudla, H, Mohanty, S, Jabbari, M, Ambat, R, Hattel, J. H

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Humidity Buildup in Electronic Enclosures Exposed to Constant Conditions von Conseil-Gudla, H., Staliulionis, Z., Jellesen, M. S., Jabbari, M., Hattel, J. H., Ambat, R.

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Thermal Modelling and Design of On-board DC-DC Power Converter using Finite Element Method von Staliulionis, Z., Zhang, Z., Pittini, R., Andersen, M. A. E., Noreika, A., Tarvydas, P.

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Investigation of Heat Sink Efficiency for Electronic Component Cooling Applications von Staliulionis, Z., Zhang, Z., Pittini, R., Andersen, M. A. E., Tarvydas, P., Noreika, A.

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Humidity build-up in electronic enclosures exposed to different geographical locations by RC modelling and reliability prediction von Conseil-Gudla, H., Staliulionis, Z., Mohanty, S., Jellesen, M.S., Hattel, J.H., Ambat, R.

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Analysis of Heat Sink Modelling Performance von Tarvydas, P., Noreika, A., Staliulionis, Z.

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Analysis of heat sink modelling performance von Tarvydas, P, Noreika, A, Staliulionis, Z

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