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  1. 1
    Rework of Lead-Free Area Array Packages Assembled on Ultrathin Flexible Substrates

    Rework of Lead-Free Area Array Packages Assembled on Ultrathin Flexible Substrates von Chennagiri, G, Iyer, S S, Srihari, K H


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  2. 2
    Effect of pad design (SMD/NSMD), via-in-pad, and reflow profile parameters on voiding during the lead-free solder bumping process

    Effect of pad design (SMD/NSMD), via-in-pad, and reflow profile parameters on voiding during the lead-free solder bumping process von Pandiarajan, Ganesh, Iyer, Satyanarayan Satya, Chennagiri, Gurudutt, Havens, Ross, Srihari, Krishnaswami Hari


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