3D-interconnect: Visualization of extrusion and voids induced in copper-filled through-silicon vias (TSVs) at various temperatures using X-ray microscopy von Kong, LayWai, Rudack, Andrew C., Krueger, Peter, Zschech, Ehrenfried, Arkalgud, Sitaram, Diebold, A.C.

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Investigation of optical properties of benzocyclobutene wafer bonding layer used for 3D interconnects via infrared spectroscopic ellipsometry von Kamineni, Vimal K., Singh, Pratibha, Kong, LayWai, Hudnall, John, Qureshi, Jamal, Taylor, Chris, Rudack, Andy, Arkalgud, Sitaram, Diebold, Alain C.

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300-mm Production-Worthy Magnetically Enhanced Non-Bosch Through-Si-Via Etch for 3-D Logic Integration von Teh, W H, Caramto, R, Chidambaram, Thenappan, Wei Wang, Arkalgud, Sitaram R, Saito, T, Maruyama, K, Maekawa, Kaoru

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3D-TSV overview von Arkalgud, Sitaram

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SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR DEVICES von SITARAM, Arkalgud

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SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR DEVICES von ARKALGUD, Sitaram

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3D-TSV overview von Arkalgud, S

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Process Optimization for 3-D IC Assembly von Woychik, Charles G., Lee, Sangil, McGrath, Scott, Arkalgud, Sitaram

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Leading edge 3D technology for high volume manufacturing von Arkalgud, S.R.

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Challenges of Scalable 2.5D IC Assembly von Wang, Liang, Woychik, Charles G., Gao, Guilian, Villavicencio, Grant, McGrath, Scott, Shen, Hong, Arkalgud, Sitaram

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CAPACITIVE COUPLING OF INTEGRATED CIRCUIT DIE COMPONENTS von HABA, Belgacem, SITARAM, Arkalgud, R

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METHODS FOR FABRICATING SEMICONDUCTOR DEVICES WITH BACKSIDE POWER DELIVERY NETWORK USING LASER LIFTOFF LAYER von CHAE, Soo Doo, SITARAM, Arkalgud

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METHOD FOR CAPACITIVE COUPLING OF INTEGRATED CIRCUIT DIE COMPONENTS von HABA, Belgacem, SITARAM, Arkalgud, R

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METHODS FOR FABRICATING SEMICONDUCTOR DEVICES WITH BACKSIDE POWER DELIVERY NETWORK USING LASER LIFTOFF LAYER von Sitaram, Arkalgud, Chae, Soo Doo

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CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONIC DEVICES von Sitaram, Arkalgud R, Haba, Belgacem

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CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONIC DEVICES von HABA, Belgacem, SITARAM, Arkalgud R

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Capacitive coupling in a direct-bonded interface for microelectronic devices von Sitaram, Arkalgud R, Haba, Belgacem

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Yield considerations in the choice of 3D technology von Smith, G., Smith, L., Hosali, S., Arkalgud, S.

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A 16-Mb MRAM featuring bootstrapped write drivers von Gogl, D., Arndt, C., Barwin, J.C., Bette, A., DeBrosse, J., Gow, E., Hoenigschmid, H., Lammers, S., Lamorey, M., Yu Lu, Maffitt, T., Maloney, K., Obermaier, W., Sturm, A., Viehmann, H., Willmott, D., Wood, M., Gallagher, W.J., Mueller, G., Sitaram, A.R.

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CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONIC DEVICES von HABA, Belgacem, SITARAM, Arkalgud R

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