Electroless Co–P for diffusion barrier in Pb-free soldering von Magagnin, L., Sirtori, V., Seregni, S., Origo, A., Cavallotti, P.L.

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Unusually Large Magnetic Anisotropy in Electrochemically Deposited Co-Rich Co–Pt Films von Sirtori, V, Cavallotti, P. L, Rognoni, R, Xu, X, Zangari, G, Fratesi, G, Trioni, M. I, Bernasconi, M

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Electrodeposition of cobalt platinum alloys micromagnets von Franz, S, Cavallotti, P.L, Bestetti, M, Sirtori, V, Lombardi, L

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Calculation model of rough gold optical constants von Sirtori, V., Magagnin, L., Saglia, E., Cavallotti, P.L.

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XPS and ellipsometric characterization of zinc-BTA complex von SIRTORI, V, ZAMBON, F, LOMBARDI, L

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Determination of correct composition in nickel–phosphorus films by XPS angle resolved technique von Sirtori, V, Lombardi, L, Cavallotti, P.L, Magagnin, L

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Chemical composition and thermal stability of 2 butyl, 5 chloro, benzimidazole film von SIRTORI, V, LOMBARDI, L, REDAELLI, G

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Optical ellipsometry and electron spectroscopy studies of copper oxidation related to copper on printed circuit boards von Manara, A., Sirtori, V., Mammarella, L.

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Surface investigation of copper in the printed circuit board von Manara, A., Sirtori, V.

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Manual autotraction: preliminary study on the effectiveness of a new device for back pain treatment von Bonaiuti, D, Gatti, R, Raschi, A, Cantarelli, L, Sirtori, V

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Viscoelastic properties of solder pastes von LAPASIN, R, PRICL, S, SIRTORI, V, CASATI, D

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Reactivity of no-clean pastes and fluxes for the surface mount technology process—part I: Corrosion behavior of Cu, Sn, and Pb von Cavallotti, P. L., Zangari, G., Sirtori, V.

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Electrodeposition of cobalt platinum alloys micromagnets von FRANZ, S, CAVALLOTTI, P. L, BESTETTI, M, SIRTORI, V, LOMBARDI, L

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Reactivity of no-clean pastes and fluxes for the surface mount technology process. I: corrosion behavior of Cu, Sn and Pb von CAVALLOTTI, P. L, ZANGARI, G, SIRTORI, V

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Reactivity of no-clean pastes and fluxes for the surface mount technology process—part II: Corrosion risk measurements for printed circuit boards and solder joints von Cavallotti, P. L., Zangari, G., Sirtori, V., Manara, A.

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Reactivity of no-clean pastes and fluxes for the surface mount technology process. II: corrosion risk measurements for printed circuit boards and solder joints von CAVALLOTTI, P. L, ZANGARI, G, SIRTORI, V, MANARA, A

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Rheological characterization of solder pastes von LAPASIN, R, SIRTORI, V, CASATI, D

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Zinc influence on copper soldering and passivation von CAVALLOTTI, P. L, MAGAGNIN, L, SIRTORI, V, ZAMBON, F

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PROCESSO,CELULA E DISPOSITIVO PARA A CONVERSAO DIRETA DE ENERGIA RADIANTE EM ENERGIA ELETRICA von SIRTORI V, BELLOBONO I, CALGARI S

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Maternal exposure to air pollutants, PCSK9 levels, fetal growth and gestational age – An Italian cohort von Macchi, C., Iodice, S., Persico, N., Ferrari, L., Cantone, L., Greco, M.F., Ischia, B., Dozio, E., Corsini, A., Sirtori, C.R., Ruscica, M., Bollati, V.

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