Plastic packaging is highly reliable von Sinnadurai, N.

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Microelectronics Markets in Europe von Sinnadurai, N

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Multichip Modules — Communications Markets and Materials Opportunities for Space von Sinnadurai, N

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Reliability of new packaging concepts von Sinnadurai, Nihal

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A critique of the Reliability Analysis Center failure-rate-model for plastic encapsulated microcircuits von Sinnadurai, N., Shukla, A.A., Pecht, M.

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Hybrid Microelectronics and the Market Opportunities in Europe von Sinnadurai, N

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Plastic packages survive where hermetic packages fail: Reliability physics of advanced electron devices von SINNADURAI, N

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More than a decade of the non-saturating autoclave as a highly accelerated stress technique for evaluating the reliability of nonhermetic microelectronic components von Sinnadurai, N.

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Reliability of electronics & photonics - Managing the time bomb von Sinnadurai, N.

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Long-Term Mechanical Circulatory Support of an Adult Patient With Down Syndrome von Nunes, Abraham J., BS, Buchholz, Holger, MD, Sinnadurai, Selvi, RN, MacArthur, Roderick G., MD

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A Technique for the Measurement of Hot Spots and Isotherm Profiles at the Surfaces of the Elements of Hybrid Microcircuits von F. N. Sinnadurai

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The past, present and future of EEE components for space application; COTS-the next generation von Wall, J., Sinnadurai, N.

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The past, present and future of EEE components for space application : COTS : the next generation von WALL, J, SINNADURAI, N

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Advanced fillers for electronics encapsulation and electro-magnetic compatibility (EMC) von Sinnadurai, N.

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Plastic packages survive where hermetic packages fail von Sinnadurai, Nihal

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EPIC, a Cost-Effective Plastic Chip Carrier for VLSI Packaging von Sinnadurai, N.

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ISHM news von Binner, H, Law, H.T, Sinnadurai, N, Jones, G, Ongley, P.E

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Accelerated ageing of IMPATT diodes von Sinnadurai, F.N

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Trends in Surface Mounting Technology and Beyond von Sinnadurai, N.

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Chip Carrier Based Systems and their Testability von Maunder, C, Roberts, D, Sinnadurai, N

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