Guided waves propagating in a piezoelectric plate immersed in a conductive fluid von Yang, C.-H., Shue, C.J.

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Guided waves propagating in a piezoelectric plate immersed in a conductive fluid von Che-Hua Yang, Shue, C.J.

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Amplification and Overexpression of Cyclin D1 in Human Hepatocellular Carcinoma von Zhang, Y.J., Jiang, W., Chen, C.J., Lee, C.S., Kahn, S.M., Santella, R.M., Weinstein, I.B.

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Low capacitance approaches for 22nm generation Cu interconnect von Bao, T.I., Chen, H.C., Lee, C.J., Lu, H.H., Shue, S.L., Yu, C.H.

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Challenges of Low Effective-K approaches for future Cu interconnect von Bao, T.I., Chen, H.C., Lee, C.J., Lu, H.H., Chen, H.W., Tsai, H.Y., Lin, C.C., Jeng, S.P., Shue, S.L., Yu, C.H.

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Direct plating of Cu on ALD TaN for 45nm node Cu BEOL metallization von Shih, C.H., Su, H.W., Lin, C.J., Ko, T., Chen, C.H., Huang, J.J., Chou, S.W., Peng, C.H., Hsieh, C.H., Tsai, M.H., Shue, W., Yu, C.H., Liang, M.S.

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Design of ECP additive for 65 nm-node technology Cu BEOL reliability von Shih, C.H., Chou, S.W., Lin, C.J., Ko, T., Su, H.W., Wu, C.M., Tsai, M.H., Shue, W.S., Yu, C.H., Liang, M.S.

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High performance/reliability Cu interconnect with selective CoWP cap von Ko, T., Chang, C.L., Chou, S.W., Lin, M.W., Lin, C.J., Shih, C.H., Su, H.W., Tsai, M.H., Shue, W.S., Liang, M.S.

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