Design and fabrication of a MEMS scanning mirror with and without comb offset von Yick Chuen Chan, Chun Cheong Wong, Congshun Wang, Wei Ma, Ho-Yin Chan, Shoulung Chen, Hon Lung Cheung, Lee, F C S, Chen-Jung Tsai

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Embedded active device packaging technology for next-generation chip-in-substrate package, CiSP von Cheng-Ta Ko, Shoulung Chen, Chia-Wen Chiang, Tzu-Ying Kuo, Ying-Ching Shih, Yu-Hua Chen

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Study on the effects of wafer thinning and dicing on chip strength von Chen, S., Tsai, C.Z., Wu, E., Shih, I.G., Chen, Y.N.

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The evaluation of wafer thinning and singulating processes to enhance chip strength von Shoulung Chen, Tzu-Ying Kuo, Hsu-Tien Hu, Jyh-Rong Lin, Shan-Pu Yu

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Mechanical behavior of flip chip packages under thermal loading von Shoulung Chen, Tsai, C.Z., Kao, N., Enboa Wu

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Chip-in-substrate package, CiSP, technology von Yu-Hua Chen, Jyh-Rong Lin, Shoulung Chen, Cheng-Ta Ko, Tzu-Ying Kuo, Chien-wei Chien, Shan-Pu Yu, Ostmann, A., Neumann, A.

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HIGH DYNAMIC RANGE IMAGE RECORDER von LIU, YING, HUANG, DANDING, CHEN, SHOULUNG, TSAI, CHEN-JUNG

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How to improve chip strength to avoid die cracking in a package von Shoulung Chen, Shih, I.G., Chen, Y.N., Tsai, C.Z., Lin, J.W., Enboa Wu

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